Research output
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2020
Test Structures for Developing Packaging for Implantable Sensors
Blair, E., Buchoux, A., Tsiamis, A., Dunare, C., Marland, J., Gray, M., Terry, J., Smith, S. & Walton, A., 17 Apr 2020, (E-pub ahead of print) In: IEEE Transactions on Semiconductor Manufacturing.Research output: Contribution to journal › Article › peer-review
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