Optimisation of sub-100nm copper-interconnect and photoresist tracks for high density IC fabrication metrology

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2007
Extraction of sheet resistance and linewidth from all-copper ECD test structures fabricated from silicon preforms
Shulver, B. J. R., Bunting, A., Gundlach, A. M., Haworth, L. I., Ross, A. W. S., Smith, S., Snell, T., Stevenson, T., Walton, A. J., Allen, R. A. & Cresswell, M. W., Mar 2007, IEEE International Conference on Microelectronic Test Structures 2007 . p. 14-19 6 p.
Research output: Chapter in Book/Report/Conference proceeding › Other chapter contribution
2006
Design and fabrication of a copper test structure for use as an electrical critical dimension reference
Shulver, B. J. R., Bunting, A. S., Gundlach, A. M., Haworth, L. I., Ross, A. W. S., Snell, A. J., Stevenson, J. T. M., Walton, A. J., Allen, R. A. & Cresswell, M. W., 2006, ICMTS 2006: Proceedings of the 2006 International Conference on Microelectronic Test Structures. NEW YORK: IEEE, ELECTRON DEVICES SOC & RELIABILITY GROUP, Vol. 2006. p. 124-129 6 p.
Research output: Chapter in Book/Report/Conference proceeding › Other chapter contribution

Research output