Research output per year
Research output per year
- 17 results
Search results
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2016
Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures
Murray, J., Perry, R., Terry, J., Smith, S., Mount, A. & Walton, A., 29 Mar 2016, Proceedings of IEEE International Conference on Microelectronic Test Structures. p. 178-183 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open AccessFile -
2015
Combined transmission line measurement structures to study thin film resistive sensor fabrication
Tabasnikov, A., Walton, A. J. & Smith, S., 2015, 2015 International Conference on Microelectronic Test Structures (ICMTS). Institute of Electrical and Electronics Engineers, p. 175-180 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Test structures for the wafer mapping and correlation of electrical, mechanical and high frequency magnetic properties of electroplated ferromagnetic alloy films
Sirotkin, E., Smith, S., Walker, R., Terry, J. G. & Walton, A. J., 2015, 2015 International Conference on Microelectronic Test Structures (ICMTS). Institute of Electrical and Electronics Engineers, p. 182-187 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2014
Air-CPW test structure for broadband permeability spectra measurements of thin ferromagnetic films
Sirotkin, E., Walker, R., Terry, J. G., Smith, S. & Walton, A. J., Mar 2014, Microelectronic Test Structures (ICMTS), 2014 International Conference on. Institute of Electrical and Electronics Engineers, p. 177-181 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Characterisation of residual stress in dielectric films studied by automated wafer mapping
Walker, R., Sirotkin, E., Schiavone, G., Terry, J. G., Smith, S., Mount, A. R., Desmulliez, M. P. Y. & Walton, A. J., Mar 2014, Microelectronic Test Structures (ICMTS), 2014 International Conference on. Institute of Electrical and Electronics Engineers, p. 98-103 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Characterization and development of materials for an integrated high-temperature sensor using resistive test structures
Tabasnikov, A., Bunting, A. S., Terry, J. G., Murray, J., Cummins, G., Zhao, C., Zhou, J., Fu, R. Y., Desmulliez, M. P. Y., Walton, A. J. & Smith, S., Mar 2014, Microelectronic Test Structures (ICMTS), 2014 International Conference on. Institute of Electrical and Electronics Engineers, p. 188-193 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Effect of seed layers on the performance of planar spiral microinductors
Walker, R., Sirotkin, E., Terry, J. G., Smith, S., Desmulliez, M. P. Y. & Walton, A. J., Mar 2014, Microelectronic Test Structures (ICMTS), 2014 International Conference on. Institute of Electrical and Electronics Engineers, p. 135-140 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2013
Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils
Walker, R., Sirotkin, E., Schmueser, I., Terry, J. G., Smith, S., Stevenson, J. T. M. & Walton, A. J., 2013, Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. Institute of Electrical and Electronics Engineers, p. 7-12 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresist
Zhang, R., Li, Y., Murray, J., Bunting, A. S., Smith, S., Dunare, C. C., Stevenson, J. T. M., Desmulliez, M. P. & Walton, A. J., 2013, Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. p. 37-42 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2012
Correlation of optical and electrical test structures for characterisation of copper self-annealing
Murray, J., Smith, S., Schiavone, G., Terry, J. G., Mount, A. R. & Walton, A. J., 1 Mar 2012, Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on. p. 152 -158Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Modification and characterisation of material hydrophobicity for surface acoustic wave driven microfluidics
Zou, H., Li, Y., Smith, S., Bunting, A., Walton, A. J. & Terry, J. G., 1 Mar 2012, Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on. p. 61 -65 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open AccessFile -
Quantitative wafer mapping of residual stress in electroplated NiFe films using independent strain and Young's modulus measurements
Schiavone, G., Desmulliez, M. P. Y., Smith, S., Murray, J., Sirotkin, E., Terry, J. G., Mount, A. R. & WaIton, A. J., 2012, IEEE International Conference on Microelectronic Test Structures. NEW YORK: Institute of Electrical and Electronics Engineers, p. 105 -110 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2011
Test structures and a measurement system for characterising the lifetime of EWOD devices
Gruber, D., Li, Y., Smith, S., Tiwari, A., Deng, F., Stokes, A., Terry, J., Bunting, A., Mackay, C., Langridge-Smith, P. & Walton, A., Apr 2011, 2011 IEEE International Conference on Microelectronic Test Structures (ICMTS). NEW YORK: Institute of Electrical and Electronics Engineers, p. 80-84 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements
Murray, J., Schiavone, G., Smith, S., Terry, J., Mount, A. & Walton, A., 2011, 2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS). NEW YORK: Institute of Electrical and Electronics Engineers, p. 63-68 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Interdigitated Electrode Modelling for Applications in Dielectrophoresis
Chung, C., Smith, S., Menachery, A., Bagnaninchi, P., Pethig, R. & Walton, A., 2011, 2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS). NEW YORK: Institute of Electrical and Electronics Engineers, p. - 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2010
Test Structures for Characterising the Integration of EWOD and SAW Technologies for Microfluidics
Li, Y., Fu, Y. Q., Flynn, B., Parkes, W., Liu, Y., Brodie, S., Terry, J., Haworth, L., Bunting, A., Stevenson, T., Smith, S. & Walton, A., 25 Mar 2010, Proceedings of the IEEE International Conference on Microelectronic Test Structures (ICMTS10). Institute of Electrical and Electronics Engineers, p. 52-57 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Fabrication of Test Structures to Monitor Stress in SU-8 Films used for MEMS Applications
Smith, S., Brockie, N. L., Murray, J., Wilson, C. J., Horsfall, A. B., Terry, J., Stevenson, T., Mount, A. & Walton, A., 2010, 2010 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, 23RD IEEE ICMTS CONFERENCE PROCEEDINGS. NEW YORK: Institute of Electrical and Electronics Engineers, p. 813 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution