SMART microsystems

Walton, Anthony (Principal Investigator)

School of Engineering

31 Article
17 Conference contribution
4 Paper
1 Literature review
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- 1 Web publication/site

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2012
A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers
Smith, S., Bridle, H. & Miller, B., 24 Apr 2012
Research output: Non-textual form › Web publication/site