基于3D电场时频分析的隔离开关绝缘缺陷检测方法

Translated title of the contribution: Insulation Defect Detection Method for Disconnecting Switches Based on Time-frequency Analysis of 3D Electric Fields

Lin Cheng, Hongye Zhang, Tongqiang Yi, Yanzhao Xie, Simeng Feng, Xiang Liu

Research output: Contribution to journalArticlepeer-review

Abstract

Previous studies have shown that the waveform characteristics of the transiently radiated fields generated by switching operations in the external space of gas insulated substations (GIS) can reflect the operating state of a switch. In order to verify the idea that the feature analysis of the transiently switching electric fields (E-fields) can be applied to the fault diagnosis of the switch, based on the disconnecting switch(DS) test platform of China Electric Power Research Institute, we measured the transiently spatial switching E-fields under different working states by using a non-invasive 3D radiation E-field measurement system. Then, the correlation between the characteristics of the switching E-fields and the functioning status, including normal working state, inner point discharge and external point discharge was respectively established. The results show that the detailed waveform and the characteristic frequency distribution of the switching E-field pulses under insulation defects obviously differ from the case of normal operating state. Thus, the insulation fault detection for DS can be realized by monitoring and analyzing the transient E-fields due to switching operations. The research provides a new idea for the fault diagnosis domain with respect to switchgear such as DS.

Translated title of the contributionInsulation Defect Detection Method for Disconnecting Switches Based on Time-frequency Analysis of 3D Electric Fields
Original languageChinese (Simplified)
Article number1417-1423
JournalGaodianya Jishu
Volume46
Issue number4
DOIs
Publication statusPublished - 30 Apr 2020

Fingerprint

Dive into the research topics of 'Insulation Defect Detection Method for Disconnecting Switches Based on Time-frequency Analysis of 3D Electric Fields'. Together they form a unique fingerprint.

Cite this