8.25μm Pitch 66% Fill Factor Global Shared Well SPAD Image Sensor in 40nm CMOS FSI Technology

Tarek Al abbas, Neale Dutton, Oscar Almer, Francesco Mattioli Della Rocca, Sara Pellegrini, Bruce R. Rae, D Golanski, Robert Henderson

Research output: Contribution to conferencePaperpeer-review

Abstract / Description of output

We present the first single photon avalanche
diode (SPAD) device and image sensor realized in a
customized 40nm CMOS front side illuminated (FSI)
technology. The 96×40 array utilizes a global shared well
layout structure with up to 66% fill factor at 8.25μm pitch
and median dark count rate (DCR) less than 70cps at 1V
excess bias. A rising edge to rising edge time gating
technique is demonstrated achieving a minimum time gate
of 360ps FWHM.
Original languageEnglish
Number of pages4
Publication statusPublished - 2 Jun 2017
EventInternational Image Sensor Workshop 2017 - Hiroshima, Japan
Duration: 30 May 20172 Jun 2017

Workshop

WorkshopInternational Image Sensor Workshop 2017
Abbreviated titleIISW 2017
Country/TerritoryJapan
CityHiroshima
Period30/05/172/06/17

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