A 128×120 5-Wire 1.96mm2 40nm/90nm 3D Stacked SPAD Time Resolved Image Sensor SoC for Microendoscopy

Tarek Al Abbas; Oscar Almer; Samuel Hutchings; Ahmet Erdogan; Istvan Gyongy; Neale Dutton; Robert Henderson

doi:10.23919/VLSIC.2019.8777979

A 128×120 5-Wire 1.96mm2 40nm/90nm 3D Stacked SPAD Time Resolved Image Sensor SoC for Microendoscopy

Tarek Al Abbas, Oscar Almer, Samuel Hutchings, Ahmet Erdogan, Istvan Gyongy, Neale Dutton, Robert Henderson

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An ultra-compact 1.4mm×1.4mm, 128×120 SPAD image sensor with a 5-wire interface is designed for time-resolved fluorescence microendoscopy. Dynamic range (DR) is extended by noiseless frame summation in SRAM attaining 126dB time resolved imaging at 15fps with 390ps gating resolution. The sensor SoC is implemented in STMicroelectronics 40nm/90nm 3D-stacked BSI CMOS process with 8μm pixels and 45% fill factor.

Original language	English
Title of host publication	Symposium on VLSI Circuits
Publisher	IEEE Xplore
ISBN (Electronic)	978-4-86348-720-8
ISBN (Print)	978-1-7281-0914-5
DOIs	https://doi.org/10.23919/VLSIC.2019.8777979
Publication status	Published - 29 Jul 2019
Event	VLSI Circuits Symposium - Kyoto, Japan Duration: 9 Jun 2019 → 14 Jun 2019

Conference

Conference	VLSI Circuits Symposium
Abbreviated title	VLSIC
Country/Territory	Japan
City	Kyoto
Period	9/06/19 → 14/06/19

Access to Document

10.23919/VLSIC.2019.8777979

EndocamVLSI2019submittedAccepted author manuscript, 1 MB

1 Finished

Multiplexed 'Touch and Tell' Optical Molecular Sensing and Imaging
Henderson, R.
EPSRC
1/10/13 → 31/03/19
Project: Research

Cite this

@inproceedings{c985f9bcb60c4b4789b6e1db25fd7d8f,

title = "A 128×120 5-Wire 1.96mm2 40nm/90nm 3D Stacked SPAD Time Resolved Image Sensor SoC for Microendoscopy",

abstract = "An ultra-compact 1.4mm×1.4mm, 128×120 SPAD image sensor with a 5-wire interface is designed for time-resolved fluorescence microendoscopy. Dynamic range (DR) is extended by noiseless frame summation in SRAM attaining 126dB time resolved imaging at 15fps with 390ps gating resolution. The sensor SoC is implemented in STMicroelectronics 40nm/90nm 3D-stacked BSI CMOS process with 8μm pixels and 45% fill factor.",

author = "{Al Abbas}, Tarek and Oscar Almer and Samuel Hutchings and Ahmet Erdogan and Istvan Gyongy and Neale Dutton and Robert Henderson",

year = "2019",

month = jul,

day = "29",

doi = "10.23919/VLSIC.2019.8777979",

language = "English",

isbn = "978-1-7281-0914-5",

booktitle = "Symposium on VLSI Circuits",

publisher = "IEEE Xplore",

note = "VLSI Circuits Symposium, VLSIC ; Conference date: 09-06-2019 Through 14-06-2019",

}

TY - GEN

T1 - A 128×120 5-Wire 1.96mm2 40nm/90nm 3D Stacked SPAD Time Resolved Image Sensor SoC for Microendoscopy

AU - Al Abbas, Tarek

AU - Almer, Oscar

AU - Hutchings, Samuel

AU - Erdogan, Ahmet

AU - Gyongy, Istvan

AU - Dutton, Neale

AU - Henderson, Robert

PY - 2019/7/29

Y1 - 2019/7/29

N2 - An ultra-compact 1.4mm×1.4mm, 128×120 SPAD image sensor with a 5-wire interface is designed for time-resolved fluorescence microendoscopy. Dynamic range (DR) is extended by noiseless frame summation in SRAM attaining 126dB time resolved imaging at 15fps with 390ps gating resolution. The sensor SoC is implemented in STMicroelectronics 40nm/90nm 3D-stacked BSI CMOS process with 8μm pixels and 45% fill factor.

AB - An ultra-compact 1.4mm×1.4mm, 128×120 SPAD image sensor with a 5-wire interface is designed for time-resolved fluorescence microendoscopy. Dynamic range (DR) is extended by noiseless frame summation in SRAM attaining 126dB time resolved imaging at 15fps with 390ps gating resolution. The sensor SoC is implemented in STMicroelectronics 40nm/90nm 3D-stacked BSI CMOS process with 8μm pixels and 45% fill factor.

U2 - 10.23919/VLSIC.2019.8777979

DO - 10.23919/VLSIC.2019.8777979

M3 - Conference contribution

SN - 978-1-7281-0914-5

BT - Symposium on VLSI Circuits

PB - IEEE Xplore

T2 - VLSI Circuits Symposium

Y2 - 9 June 2019 through 14 June 2019

ER -

A 128×120 5-Wire 1.96mm2 40nm/90nm 3D Stacked SPAD Time Resolved Image Sensor SoC for Microendoscopy

Abstract

Conference

Access to Document

Fingerprint

Projects

Multiplexed 'Touch and Tell' Optical Molecular Sensing and Imaging

Cite this