Projects per year
Abstract
A digital silicon photomultiplier in 130-nm CMOS imaging technology implements time-correlated single photon counting at an order of magnitude beyond the conventional pile-up limit. The sensor comprises a 32 × 32 43% fill-factor single photon avalanche diode array with a multi-event folded-flash time-to-digital converter architecture operating at 10 GS/s. 264 bins × 16 bit histograms are generated and read out from the chip at a maximal 188 kHz enabling fast time resolved scanning or ultrafast low-light event capture. Full optical and electrical characterization results are presented.
Original language | English |
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Pages (from-to) | 3163-3173 |
Number of pages | 11 |
Journal | IEEE Sensors Journal |
Volume | 18 |
Issue number | 8 |
Early online date | 6 Feb 2018 |
DOIs | |
Publication status | Published - 15 Apr 2018 |
Keywords / Materials (for Non-textual outputs)
- time to digital converter
- Single Photon Avalanche Diode
- optical sensor
- CMOS
- silicone photomultiplier
Fingerprint
Dive into the research topics of 'A CMOS SPAD Sensor with a Multi-Event Folded Flash Time-to-Digital Converter for Ultra-fast Optical Transient Capture'. Together they form a unique fingerprint.Projects
- 3 Finished
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Ultrafast Imaging using Quantum Technologies (ULTRA-IMAGE)
Henderson, R. (Principal Investigator)
1/02/15 → 31/01/18
Project: Research
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Multiplexed 'Touch and Tell' Optical Molecular Sensing and Imaging
Henderson, R. (Principal Investigator)
1/10/13 → 31/03/19
Project: Research
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PhD Student Support- as part of the UoE/STMicroelectronic Research Collaboration
Henderson, R. (Principal Investigator)
UK industry, commerce and public corporations
1/01/11 → 29/02/20
Project: Research
Profiles
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Robert Henderson
- School of Engineering - Personal Chair of Electronic Imaging
Person: Academic: Research Active