Abstract / Description of output
This paper examines the effect of cure temperature and humidity upon the glass transition response of a typical ambient-cure epoxy adhesive. The adhesive was cured at two different temperatures (24°C and 50°C) and two extremes of humidity (dry and saturated), for up to 28 days. Its glass transition response was determined using dynamic mechanical analysis (DMA). This fundamental data will be of use to designers and researchers studying the warm temperature response of FRP bonded strengthening and adhesive joints.
The results demonstrate that on site (at 24°C) the adhesive does not achieve full chemical cure, and consequently the adhesive properties used during design (such as the data sheet values) should be based on similar cure conditions. Furthermore, curing the adhesive at elevated temperature to obtain a quick adhesive test result for quality assurance purposes is not necessarily a safe or representative assessment of the long-term properties of the on-site adhesive.
The results demonstrate that on site (at 24°C) the adhesive does not achieve full chemical cure, and consequently the adhesive properties used during design (such as the data sheet values) should be based on similar cure conditions. Furthermore, curing the adhesive at elevated temperature to obtain a quick adhesive test result for quality assurance purposes is not necessarily a safe or representative assessment of the long-term properties of the on-site adhesive.
| Original language | English |
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| Title of host publication | Proceedings of Fibre Reinforced Polymer Reinforced Concrete Structures |
| Publication status | Published - 26 Jun 2013 |