A Low Cost Patternable Packaging Technology for Biosensors

Anthony Buchoux, Ewen Blair, Andreas Tsiamis, Jamie Marland, Stewart Smith

Research output: Contribution to conferencePaperpeer-review

Abstract

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.
Original languageEnglish
Pages184 - 189
Number of pages6
Publication statusPublished - 29 May 2017
Event2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS - Bordeaux, France
Duration: 29 May 20171 Jun 2017

Symposium

Symposium2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
Abbreviated titleDTIP
CountryFrance
CityBordeaux
Period29/05/171/06/17

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