A Low Cost Patternable Packaging Technology for Biosensors

Anthony Buchoux; Ewen Blair; Andreas Tsiamis; Jamie Marland; Stewart Smith

A Low Cost Patternable Packaging Technology for Biosensors

Anthony Buchoux, Ewen Blair, Andreas Tsiamis, Jamie Marland, Stewart Smith

School of Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract / Description of output

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

Original language	English
Pages	184 - 189
Number of pages	6
Publication status	Published - 29 May 2017
Event	2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS - Bordeaux, France Duration: 29 May 2017 → 1 Jun 2017

Symposium

Symposium	2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS
Abbreviated title	DTIP
Country/Territory	France
City	Bordeaux
Period	29/05/17 → 1/06/17

Access to Document

dtip17-42-3Accepted author manuscript, 7.42 MB

Implantable Microsystems for Personalised Anti-Cancer Therapy
Murray, A., Smith, S. & Walton, A.
EPSRC
27/05/13 → 31/05/19
Project: Research

Cite this

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title = "A Low Cost Patternable Packaging Technology for Biosensors",

abstract = "This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.",

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AU - Buchoux, Anthony

AU - Blair, Ewen

AU - Tsiamis, Andreas

AU - Marland, Jamie

AU - Smith, Stewart

PY - 2017/5/29

Y1 - 2017/5/29

N2 - This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

AB - This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

M3 - Paper

SP - 184

EP - 189

T2 - 2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS

Y2 - 29 May 2017 through 1 June 2017

ER -

A Low Cost Patternable Packaging Technology for Biosensors

Abstract / Description of output

Symposium

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Projects

Implantable Microsystems for Personalised Anti-Cancer Therapy

Cite this