Projects per year
Abstract / Description of output
This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.
|Pages||184 - 189|
|Number of pages||6|
|Publication status||Published - 29 May 2017|
|Event||2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS - Bordeaux, France|
Duration: 29 May 2017 → 1 Jun 2017
|Symposium||2017 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS|
|Period||29/05/17 → 1/06/17|
FingerprintDive into the research topics of 'A Low Cost Patternable Packaging Technology for Biosensors'. Together they form a unique fingerprint.
- 1 Finished
Murray, A., Smith, S. & Walton, A.
27/05/13 → 31/05/19