A QoS-Enabled On-Die Interconnect Fabric for Kilo-Node Chips

B. Grot, J. Hestness, S.W. Keckler, O. Mutlu

Research output: Contribution to journalArticlepeer-review

Abstract / Description of output

To meet rapidly growing performance demands and energy constraints, future chips will likely feature thousands of on-die resources. Existing network-on-chip solutions weren't designed for scalability and will be unable to meet future interconnect demands. A hybrid network-on-chip architecture called Kilo-NoC co-optimizes topology, flow control, and quality of service to achieve significant gains in efficiency.
Original languageEnglish
Pages (from-to)17-25
Number of pages9
JournalIEEE Micro
Volume32
Issue number3
DOIs
Publication statusPublished - 1 May 2012

Keywords / Materials (for Non-textual outputs)

  • network-on-chip
  • power aware computing
  • quality of service
  • Kilo-NoC cooptimizes topology
  • QoS enabled on die interconnect fabric
  • energy constraints
  • flow control
  • kilo node chips
  • ondie resources
  • Dies
  • Energy management
  • Network topology
  • Quality of service
  • Scalability
  • System recovery
  • Topology
  • Kilo-NoC
  • MECS
  • nework on chip
  • scalability

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