A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers

Stewart Smith, Helen Bridle, Brian Miller

Research output: Non-textual formWeb publication/site

Abstract

Brian Miller, Stewart Smith and Helen Bridle refine a method to prevent the sagging of high aspect ratio channels during bonding, which allows the technique to be applied to shallower channels for devices in which performance is sensitive to channel height
Original languageEnglish
PublisherRoyal Society of Chemistry
Publication statusPublished - 24 Apr 2012

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