A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers

Stewart Smith; Helen Bridle; Brian Miller

A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers

Stewart Smith, Helen Bridle, Brian Miller

School of Engineering

Research output: Non-textual form › Web publication/site

Abstract / Description of output

Brian Miller, Stewart Smith and Helen Bridle refine a method to prevent the sagging of high aspect ratio channels during bonding, which allows the technique to be applied to shallower channels for devices in which performance is sensitive to channel height

Original language	English
Publisher	Royal Society of Chemistry
Publication status	Published - 24 Apr 2012

Access to Document

http://blogs.rsc.org/chipsandtips/2012/04/24/a-refinement-of-a-method-to-prevent-sagging-during-the-bonding-or-lamination-of-chips-with-high-aspect-ratio-chambers/

SMART microsystems
Walton, A.
EPSRC
1/04/10 → 28/02/15
Project: Research
RCUK Fellowship
Smith, S., Anderton, S., Bagnaninchi, P., Blythe, R., Calvert, J., Downes, A., Frame, M., Hay, D., Popovic, N. & Rambaut, A.
EPSRC, STFC
1/10/06 → 30/06/13
Project: Research

Cite this

Smith, S., Bridle, H., & Miller, B. (2012). A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers. Web publication/site, Royal Society of Chemistry. http://blogs.rsc.org/chipsandtips/2012/04/24/a-refinement-of-a-method-to-prevent-sagging-during-the-bonding-or-lamination-of-chips-with-high-aspect-ratio-chambers/

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title = "A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers",

abstract = "Brian Miller, Stewart Smith and Helen Bridle refine a method to prevent the sagging of high aspect ratio channels during bonding, which allows the technique to be applied to shallower channels for devices in which performance is sensitive to channel height",

author = "Stewart Smith and Helen Bridle and Brian Miller",

note = "Published on the {"}Chips and Tips{"} blog on the website of the journal Lab on a Chip by the Royal Society of Chemistry",

year = "2012",

month = apr,

day = "24",

language = "English",

publisher = "Royal Society of Chemistry",

address = "United Kingdom",

}

Smith, S, Bridle, H & Miller, B, A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers, 2012, Web publication/site, Royal Society of Chemistry. <http://blogs.rsc.org/chipsandtips/2012/04/24/a-refinement-of-a-method-to-prevent-sagging-during-the-bonding-or-lamination-of-chips-with-high-aspect-ratio-chambers/>

TY - ADVS

T1 - A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers

AU - Smith, Stewart

AU - Bridle, Helen

AU - Miller, Brian

N1 - Published on the "Chips and Tips" blog on the website of the journal Lab on a Chip by the Royal Society of Chemistry

PY - 2012/4/24

Y1 - 2012/4/24

N2 - Brian Miller, Stewart Smith and Helen Bridle refine a method to prevent the sagging of high aspect ratio channels during bonding, which allows the technique to be applied to shallower channels for devices in which performance is sensitive to channel height

AB - Brian Miller, Stewart Smith and Helen Bridle refine a method to prevent the sagging of high aspect ratio channels during bonding, which allows the technique to be applied to shallower channels for devices in which performance is sensitive to channel height

M3 - Web publication/site

PB - Royal Society of Chemistry

ER -

A refinement of a method to prevent sagging during the bonding or lamination of chips with high aspect ratio chambers

Abstract / Description of output

Access to Document

Fingerprint

Projects

SMART microsystems

RCUK Fellowship

Cite this