A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

Rui Song, Ian Underwood, Yongqiang Qiu, Holly S. Lay, Sandy Cochran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.
Original languageEnglish
Title of host publication2018 IEEE SENSORS Proceedings
Place of PublicationUSA
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages196-9
Number of pages4
ISBN (Print)978-1-5386-4707-3
DOIs
Publication statusPublished - 27 Dec 2018
EventIEEE Sensors 2018 - Pullman New Delhi Aerocity, New Delhi, India
Duration: 28 Oct 201831 Oct 2018
http://ieee-sensors2018.org

Publication series

NameIEEE Sensors
PublisherIEEE
ISSN (Electronic)2168-9229

Conference

ConferenceIEEE Sensors 2018
CountryIndia
CityNew Delhi
Period28/10/1831/10/18
Internet address

Keywords

  • Semiconductor device modeling
  • Integrated circuit modeling
  • Mathematical model
  • Data models
  • Resonant frequency
  • Acoustics
  • Impedance

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