A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

Rui Song; Ian Underwood; Yongqiang Qiu; Holly S. Lay; Sandy Cochran

doi:10.1109/ICSENS.2018.8589814

A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

Rui Song, Ian Underwood, Yongqiang Qiu, Holly S. Lay, Sandy Cochran

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract / Description of output

A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.

Original language	English
Title of host publication	2018 IEEE SENSORS Proceedings
Place of Publication	USA
Publisher	Institute of Electrical and Electronics Engineers
Pages	196-9
Number of pages	4
ISBN (Print)	978-1-5386-4707-3
DOIs	https://doi.org/10.1109/ICSENS.2018.8589814
Publication status	Published - 27 Dec 2018
Event	IEEE Sensors 2018 - Pullman New Delhi Aerocity, New Delhi, India Duration: 28 Oct 2018 → 31 Oct 2018 http://ieee-sensors2018.org

Publication series

Name	IEEE Sensors
Publisher	IEEE
ISSN (Electronic)	2168-9229

Conference

Conference	IEEE Sensors 2018
Country/Territory	India
City	New Delhi
Period	28/10/18 → 31/10/18
Internet address	http://ieee-sensors2018.org

Keywords / Materials (for Non-textual outputs)

Semiconductor device modeling
Integrated circuit modeling
Mathematical model
Data models
Resonant frequency
Acoustics
Impedance

Access to Document

10.1109/ICSENS.2018.8589814

Cite this

@inproceedings{db86ff41a4f94e63b01b64bf509ef259,

title = "A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements",

abstract = "A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.",

keywords = "Semiconductor device modeling, Integrated circuit modeling, Mathematical model, Data models, Resonant frequency, Acoustics, Impedance",

author = "Rui Song and Ian Underwood and Yongqiang Qiu and Lay, {Holly S.} and Sandy Cochran",

note = "Acceptance date set to exclude from REF OA Policy ; IEEE Sensors 2018 ; Conference date: 28-10-2018 Through 31-10-2018",

year = "2018",

month = dec,

day = "27",

doi = "10.1109/ICSENS.2018.8589814",

language = "English",

isbn = "978-1-5386-4707-3",

series = "IEEE Sensors",

publisher = "Institute of Electrical and Electronics Engineers",

pages = "196--9",

booktitle = "2018 IEEE SENSORS Proceedings",

address = "United States",

url = "http://ieee-sensors2018.org",

}

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T1 - A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

AU - Song, Rui

AU - Underwood, Ian

AU - Qiu, Yongqiang

AU - Lay, Holly S.

AU - Cochran, Sandy

N1 - Acceptance date set to exclude from REF OA Policy

PY - 2018/12/27

Y1 - 2018/12/27

N2 - A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.

AB - A new high-accuracy SPICE model for piezoelectric ultrasonic transducer array elements has been developed using advanced non-linear regression curve fitting techniques. This allows integrated design of ultrasonic array elements and CMOS circuitry, avoiding difficulties with hybrid models. Simulated and measured data show improved quality of fit across a wide frequency range when compared to a conventional model. By specifying a frequency range of interest, the non-isolated modes common in practical ultrasonic array elements can also be modelled, providing a route to the use of Monte Carlo AC simulation. This has important implications for the many future devices that will be built using CMOS circuitry integrated with ultrasonic arrays.

KW - Semiconductor device modeling

KW - Integrated circuit modeling

KW - Mathematical model

KW - Data models

KW - Resonant frequency

KW - Acoustics

KW - Impedance

UR - https://doi.org/10.7488/ds/2600

U2 - 10.1109/ICSENS.2018.8589814

DO - 10.1109/ICSENS.2018.8589814

M3 - Conference contribution

SN - 978-1-5386-4707-3

T3 - IEEE Sensors

SP - 196

EP - 199

BT - 2018 IEEE SENSORS Proceedings

PB - Institute of Electrical and Electronics Engineers

CY - USA

T2 - IEEE Sensors 2018

Y2 - 28 October 2018 through 31 October 2018

ER -

A Robust, Compact SPICE Model for Piezoelectric Ultrasonic Transducer Array Elements

Abstract / Description of output

Publication series

Conference

Keywords / Materials (for Non-textual outputs)

Access to Document

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