Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

S. Smith; N. L. Brockie; J. G. Terry; N. Wang; A. B. Horsfall; A. J. Walton

Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

S. Smith, N. L. Brockie, J. G. Terry, N. Wang, A. B. Horsfall, A. J. Walton

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.

Original language	English
Title of host publication	ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES
Place of Publication	NEW YORK
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	75-80
Number of pages	6
ISBN (Print)	978-1-4244-4259-1
Publication status	Published - 2009
Event	22nd Annual International Conference on Microelectronic Test Structures - Oxnard Duration: 30 Mar 2009 → 2 Apr 2009

Conference

Conference	22nd Annual International Conference on Microelectronic Test Structures
City	Oxnard
Period	30/03/09 → 2/04/09

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Link to publication in Scopus

1 Finished

manufacturability of Monolithic, Ferromagentic Core, Power Inductors
Walton, A.
Non-EU industry, commerce and public corporations
1/12/06 → 30/11/11
Project: Research

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Smith, S. ; Brockie, N. L. ; Terry, J. G. ; Wang, N. ; Horsfall, A. B. ; Walton, A. J. / Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film. ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES. NEW YORK : Institute of Electrical and Electronics Engineers (IEEE), 2009. pp. 75-80

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title = "Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film",

abstract = "Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.",

author = "S. Smith and Brockie, {N. L.} and Terry, {J. G.} and N. Wang and Horsfall, {A. B.} and Walton, {A. J.}",

year = "2009",

language = "English",

isbn = "978-1-4244-4259-1",

pages = "75--80",

booktitle = "ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "22nd Annual International Conference on Microelectronic Test Structures ; Conference date: 30-03-2009 Through 02-04-2009",

}

Smith, S, Brockie, NL, Terry, JG, Wang, N, Horsfall, AB & Walton, AJ 2009, Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film. in ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES. Institute of Electrical and Electronics Engineers (IEEE), NEW YORK, pp. 75-80, 22nd Annual International Conference on Microelectronic Test Structures, Oxnard, 30/03/09.

Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film. / Smith, S.; Brockie, N. L.; Terry, J. G.; Wang, N.; Horsfall, A. B.; Walton, A. J.

ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES. NEW YORK : Institute of Electrical and Electronics Engineers (IEEE), 2009. p. 75-80.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

AU - Smith, S.

AU - Brockie, N. L.

AU - Terry, J. G.

AU - Wang, N.

AU - Horsfall, A. B.

AU - Walton, A. J.

PY - 2009

Y1 - 2009

N2 - Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.

AB - Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.

UR - http://www.scopus.com/inward/record.url?scp=67650118251&partnerID=8YFLogxK

M3 - Conference contribution

SN - 978-1-4244-4259-1

SP - 75

EP - 80

BT - ICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - NEW YORK

T2 - 22nd Annual International Conference on Microelectronic Test Structures

Y2 - 30 March 2009 through 2 April 2009

ER -

Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

Abstract

Conference

Access to Document

manufacturability of Monolithic, Ferromagentic Core, Power Inductors

Cite this