Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film

S. Smith, N. L. Brockie, J. G. Terry, N. Wang, A. B. Horsfall, A. J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.

Original languageEnglish
Title of host publicationICMTS 2009: 2009 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES
Place of PublicationNEW YORK
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages75-80
Number of pages6
ISBN (Print)978-1-4244-4259-1
Publication statusPublished - 2009
Event22nd Annual International Conference on Microelectronic Test Structures - Oxnard
Duration: 30 Mar 20092 Apr 2009

Conference

Conference22nd Annual International Conference on Microelectronic Test Structures
CityOxnard
Period30/03/092/04/09

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