Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

Alan Ross; Coinneach Mackenzie Dover; Stewart Smith; Jonathan G. Terry; Andrew R Mount; Anthony J. Walton

doi:10.1109/ICMTS50340.2022.9898250

Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

Alan Ross, Coinneach Mackenzie Dover, Stewart Smith, Jonathan G. Terry, Andrew R Mount, Anthony J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.

Original language	English
Title of host publication	2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)
Publisher	IEEE
Pages	110-113
DOIs	https://doi.org/10.1109/ICMTS50340.2022.9898250
Publication status	E-pub ahead of print - 26 Sep 2022
Event	34th IEEE International Conference on Microelectronic Test Structures - Virtual Duration: 21 Mar 2022 → 23 Mar 2022 http://icmts.if.t.u-tokyo.ac.jp/about

Conference

Conference	34th IEEE International Conference on Microelectronic Test Structures
Abbreviated title	34th ICMTS Conference
Period	21/03/22 → 23/03/22
Internet address	http://icmts.if.t.u-tokyo.ac.jp/about

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10.1109/ICMTS50340.2022.9898250

2022046606Accepted author manuscript, 2.55 MB

Cite this

@inproceedings{04bab5b96e3e4493a169fd765398aff2,

title = "Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films",

abstract = "This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.",

author = "Alan Ross and {Mackenzie Dover}, Coinneach and Stewart Smith and Terry, {Jonathan G.} and Mount, {Andrew R} and Walton, {Anthony J.}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 34th IEEE International Conference on Microelectronic Test Structures, 34th ICMTS Conference ; Conference date: 21-03-2022 Through 23-03-2022",

year = "2022",

month = sep,

day = "26",

doi = "10.1109/ICMTS50340.2022.9898250",

language = "English",

pages = "110--113",

booktitle = "2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)",

publisher = "IEEE",

url = "http://icmts.if.t.u-tokyo.ac.jp/about",

}

Ross, A, Mackenzie Dover, C, Smith, S , Terry, JG , Mount, AR & Walton, AJ 2022, Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films. in 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS). IEEE, pp. 110-113, 34th IEEE International Conference on Microelectronic Test Structures, 21/03/22. https://doi.org/10.1109/ICMTS50340.2022.9898250

TY - GEN

T1 - Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

AU - Ross, Alan

AU - Mackenzie Dover, Coinneach

AU - Smith, Stewart

AU - Terry, Jonathan G.

AU - Mount, Andrew R

AU - Walton, Anthony J.

PY - 2022/9/26

Y1 - 2022/9/26

N2 - This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.

AB - This paper presents a previously documented full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. With magnetic films, non-magnetic seed layers need to be as thin as possible to minimise unwanted eddy currents. This paper uses the test structure to quantify the IR drop on the electroplated film and demonstrates how current distribution structures can be simply used to significantly improve wafer plating uniformity when using seed layer thicknesses of a few nanometers.

U2 - 10.1109/ICMTS50340.2022.9898250

DO - 10.1109/ICMTS50340.2022.9898250

M3 - Conference contribution

SP - 110

EP - 113

BT - 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)

PB - IEEE

T2 - 34th IEEE International Conference on Microelectronic Test Structures

Y2 - 21 March 2022 through 23 March 2022

ER -

Application of a Test Structure for Minimising Seed Layer Thickness of Electroplated Ferromagnetic Films

Abstract

Conference

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