Array based test structure for optical-electrical overlay calibration

B. J. R. Shulver; R. A. Allen; A. J. Walton; M. W. Cresswell; Tom Stevenson; S. Smith; Andrew Bunting; C. Dunare; A. M. Gundlach; L. I. Haworth; A. W. S. Ross; Tony Snell

Array based test structure for optical-electrical overlay calibration

B. J. R. Shulver, R. A. Allen, A. J. Walton, M. W. Cresswell, Tom Stevenson, S. Smith, Andrew Bunting, C. Dunare, A. M. Gundlach, L. I. Haworth, A. W. S. Ross, Tony Snell

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The novel overlay test structure reported in this paper was purposely designed to serve as an application-specific reference material. It features standard frame-in-frame optical overlay targets embedded in electrical test features and fabricated by the same process as the parts being manufactured. Optical overlay is commonly used in process control applications due to its utility for determining the relative positions of features patterned in photoresist. Electrical overlay, although it can only be measured on fully patterned test structures, is the metric of interest. Using this combined optical/electrical overlay test structure, we can derive the relationship between the routinely measured optical overlay and the electrical overlay for any specific combination of process and optical overlay tool.

Original language	English
Title of host publication	2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS
Place of Publication	NEW YORK
Publisher	Institute of Electrical and Electronics Engineers
Pages	165-170
Number of pages	6
ISBN (Print)	978-1-4244-0780-4
Publication status	Published - 2007
Event	IEEE International Conference on Microelectronic Test Structures - Tokyo Duration: 19 Mar 2007 → 22 Mar 2007

Conference

Conference	IEEE International Conference on Microelectronic Test Structures
City	Tokyo
Period	19/03/07 → 22/03/07

Optimisation of sub-100nm copper-interconnect and photoresist tracks for high density IC fabrication metrology
Walton, A. (Principal Investigator)
EPSRC
1/01/05 → 30/06/06
Project: Research

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Shulver, B. J. R., Allen, R. A., Walton, A. J., Cresswell, M. W., Stevenson, T., Smith, S., Bunting, A., Dunare, C., Gundlach, A. M., Haworth, L. I., Ross, A. W. S., & Snell, T. (2007). Array based test structure for optical-electrical overlay calibration. In 2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS (pp. 165-170). Institute of Electrical and Electronics Engineers.

@inproceedings{5e076f712be9426e80fcef1510dd248e,

title = "Array based test structure for optical-electrical overlay calibration",

abstract = "The novel overlay test structure reported in this paper was purposely designed to serve as an application-specific reference material. It features standard frame-in-frame optical overlay targets embedded in electrical test features and fabricated by the same process as the parts being manufactured. Optical overlay is commonly used in process control applications due to its utility for determining the relative positions of features patterned in photoresist. Electrical overlay, although it can only be measured on fully patterned test structures, is the metric of interest. Using this combined optical/electrical overlay test structure, we can derive the relationship between the routinely measured optical overlay and the electrical overlay for any specific combination of process and optical overlay tool.",

author = "Shulver, {B. J. R.} and Allen, {R. A.} and Walton, {A. J.} and Cresswell, {M. W.} and Tom Stevenson and S. Smith and Andrew Bunting and C. Dunare and Gundlach, {A. M.} and Haworth, {L. I.} and Ross, {A. W. S.} and Tony Snell",

year = "2007",

language = "English",

isbn = "978-1-4244-0780-4",

pages = "165--170",

booktitle = "2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "IEEE International Conference on Microelectronic Test Structures ; Conference date: 19-03-2007 Through 22-03-2007",

}

Shulver, BJR, Allen, RA, Walton, AJ, Cresswell, MW, Stevenson, T, Smith, S, Bunting, A, Dunare, C, Gundlach, AM, Haworth, LI, Ross, AWS & Snell, T 2007, Array based test structure for optical-electrical overlay calibration. in 2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS. Institute of Electrical and Electronics Engineers, NEW YORK, pp. 165-170, IEEE International Conference on Microelectronic Test Structures, Tokyo, 19/03/07.

Array based test structure for optical-electrical overlay calibration. / Shulver, B. J. R.; Allen, R. A.; Walton, A. J. et al.
2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS. NEW YORK: Institute of Electrical and Electronics Engineers, 2007. p. 165-170.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Array based test structure for optical-electrical overlay calibration

AU - Shulver, B. J. R.

AU - Allen, R. A.

AU - Walton, A. J.

AU - Cresswell, M. W.

AU - Stevenson, Tom

AU - Smith, S.

AU - Bunting, Andrew

AU - Dunare, C.

AU - Gundlach, A. M.

AU - Haworth, L. I.

AU - Ross, A. W. S.

AU - Snell, Tony

PY - 2007

Y1 - 2007

N2 - The novel overlay test structure reported in this paper was purposely designed to serve as an application-specific reference material. It features standard frame-in-frame optical overlay targets embedded in electrical test features and fabricated by the same process as the parts being manufactured. Optical overlay is commonly used in process control applications due to its utility for determining the relative positions of features patterned in photoresist. Electrical overlay, although it can only be measured on fully patterned test structures, is the metric of interest. Using this combined optical/electrical overlay test structure, we can derive the relationship between the routinely measured optical overlay and the electrical overlay for any specific combination of process and optical overlay tool.

AB - The novel overlay test structure reported in this paper was purposely designed to serve as an application-specific reference material. It features standard frame-in-frame optical overlay targets embedded in electrical test features and fabricated by the same process as the parts being manufactured. Optical overlay is commonly used in process control applications due to its utility for determining the relative positions of features patterned in photoresist. Electrical overlay, although it can only be measured on fully patterned test structures, is the metric of interest. Using this combined optical/electrical overlay test structure, we can derive the relationship between the routinely measured optical overlay and the electrical overlay for any specific combination of process and optical overlay tool.

M3 - Conference contribution

SN - 978-1-4244-0780-4

SP - 165

EP - 170

BT - 2007 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, PROCEEDINGS

PB - Institute of Electrical and Electronics Engineers

CY - NEW YORK

T2 - IEEE International Conference on Microelectronic Test Structures

Y2 - 19 March 2007 through 22 March 2007

ER -

Array based test structure for optical-electrical overlay calibration

Abstract

Conference

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Projects

Optimisation of sub-100nm copper-interconnect and photoresist tracks for high density IC fabrication metrology

Cite this