Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization

J. M. M. dos Santos, K. Wang, A. B. Horsfall, J. C. Prata Pina, N. G. Wright, A. G. ONeill, S. M. Soare, S. J. Bull, Jonathan Terry, Anthony Walton, A. M. Gundlach, Tom Stevenson

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)713-719
Number of pages7
JournalIEEE Transactions on Device and Materials Reliability
Volume5
Publication statusPublished - 2006

Cite this