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Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization
J M M dos Santos, A B Horsfall, J C P Pina, N G Wright, A G O'Neill, K Wang, S M Soare, S J Bull, J G Terry, A J Walton, A M Gundlach, J T M Stevenson
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution