Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization

Jorge M.M. Dos Santos; Alton B. Horsfall; Jose C.Prata Pina; Nick G. Wright; Anthony G. O'Neill; Kai Wang; Sorin M. Soare; Steve J. Bull; Jonathan G. Terry; Anthony J. Walton; Alan M. Gundlach; J. Tom M. Stevenson

Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization

Jorge M.M. Dos Santos, Alton B. Horsfall^*, Jose C.Prata Pina, Nick G. Wright, Anthony G. O'Neill, Kai Wang, Sorin M. Soare, Steve J. Bull, Jonathan G. Terry, Anthony J. Walton, Alan M. Gundlach, J. Tom M. Stevenson

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.

Original language	English
Pages (from-to)	255-258
Number of pages	4
Journal	Annual Proceedings - Reliability Physics (Symposium)
Publication status	Published - 12 Jul 2004
Event	2004 IEEE International Reliability Physics Symposium Proceedings, 42nd Annual - Phoenix, AZ., United States Duration: 25 Apr 2004 → 29 Apr 2004

Keywords / Materials (for Non-textual outputs)

Integrated circuit reliability
Interconnect
Metallisation
Reliability
Stress

Cite this

Dos Santos, J. M. M., Horsfall, A. B., Pina, J. C. P., Wright, N. G., O'Neill, A. G., Wang, K., Soare, S. M., Bull, S. J., Terry, J. G., Walton, A. J., Gundlach, A. M., & Stevenson, J. T. M. (2004). Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization. Annual Proceedings - Reliability Physics (Symposium), 255-258.

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title = "Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization",

abstract = "We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.",

keywords = "Integrated circuit reliability, Interconnect, Metallisation, Reliability, Stress",

author = "{Dos Santos}, {Jorge M.M.} and Horsfall, {Alton B.} and Pina, {Jose C.Prata} and Wright, {Nick G.} and O'Neill, {Anthony G.} and Kai Wang and Soare, {Sorin M.} and Bull, {Steve J.} and Terry, {Jonathan G.} and Walton, {Anthony J.} and Gundlach, {Alan M.} and Stevenson, {J. Tom M.}",

year = "2004",

month = jul,

day = "12",

language = "English",

pages = "255--258",

journal = "Annual Proceedings - Reliability Physics (Symposium)",

issn = "0099-9512",

note = "2004 IEEE International Reliability Physics Symposium Proceedings, 42nd Annual ; Conference date: 25-04-2004 Through 29-04-2004",

}

TY - JOUR

T1 - Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization

AU - Dos Santos, Jorge M.M.

AU - Horsfall, Alton B.

AU - Pina, Jose C.Prata

AU - Wright, Nick G.

AU - O'Neill, Anthony G.

AU - Wang, Kai

AU - Soare, Sorin M.

AU - Bull, Steve J.

AU - Terry, Jonathan G.

AU - Walton, Anthony J.

AU - Gundlach, Alan M.

AU - Stevenson, J. Tom M.

PY - 2004/7/12

Y1 - 2004/7/12

N2 - We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.

AB - We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.

KW - Integrated circuit reliability

KW - Interconnect

KW - Metallisation

KW - Reliability

KW - Stress

UR - http://www.scopus.com/inward/record.url?scp=3042557817&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:3042557817

SN - 0099-9512

SP - 255

EP - 258

JO - Annual Proceedings - Reliability Physics (Symposium)

JF - Annual Proceedings - Reliability Physics (Symposium)

T2 - 2004 IEEE International Reliability Physics Symposium Proceedings, 42nd Annual

Y2 - 25 April 2004 through 29 April 2004

ER -

Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization

Abstract

Keywords / Materials (for Non-textual outputs)

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