Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization

J. M. M. dos Santos; K. Wang; A. B. Horsfall; J. C. Prata Pina; N. G. Wright; A. G. ONeill; S. M. Soare; S. J. Bull; Jonathan Terry; Anthony Walton; A. M. Gundlach; Tom Stevenson

Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization

J. M. M. dos Santos
, K. Wang
, A. B. Horsfall
, J. C. Prata Pina
, N. G. Wright
, A. G. ONeill
, S. M. Soare
, S. J. Bull
, Jonathan Terry
, Anthony Walton
, A. M. Gundlach
, Tom Stevenson

School of Engineering

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	713-719
Number of pages	7
Journal	IEEE Transactions on Device and Materials Reliability
Volume	5
Publication status	Published - 2006

Cite this

Santos, J. M. M. D., Wang, K., Horsfall, A. B., Pina, J. C. P., Wright, N. G., ONeill, A. G., Soare, S. M., Bull, S. J., Terry, J., Walton, A., Gundlach, A. M., & Stevenson, T. (2006). Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization. IEEE Transactions on Device and Materials Reliability, 5, 713-719.

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title = "Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization",

author = "Santos, \{J. M. M. dos\} and K. Wang and Horsfall, \{A. B.\} and Pina, \{J. C. Prata\} and Wright, \{N. G.\} and ONeill, \{A. G.\} and Soare, \{S. M.\} and Bull, \{S. J.\} and Jonathan Terry and Anthony Walton and Gundlach, \{A. M.\} and Tom Stevenson",

year = "2006",

language = "English",

volume = "5",

pages = "713--719",

journal = "IEEE Transactions on Device and Materials Reliability",

publisher = "Institute of Electrical and Electronics Engineers",

}

TY - JOUR

T1 - Calibration and Optimization of Interconnect Based MEMS Test Structures for Predicting Thermo Mechanical Stress in Metallization

AU - Santos, J. M. M. dos

AU - Wang, K.

AU - Horsfall, A. B.

AU - Pina, J. C. Prata

AU - Wright, N. G.

AU - ONeill, A. G.

AU - Soare, S. M.

AU - Bull, S. J.

AU - Terry, Jonathan

AU - Walton, Anthony

AU - Gundlach, A. M.

AU - Stevenson, Tom

PY - 2006

Y1 - 2006

M3 - Article

VL - 5

SP - 713

EP - 719

JO - IEEE Transactions on Device and Materials Reliability

JF - IEEE Transactions on Device and Materials Reliability

ER -