Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils

Ross Walker, E. Sirotkin, Ilka Schmueser, J.G. Terry, S. Smith, J.T.M. Stevenson, A.J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationMicroelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages6
Publication statusPublished - 2013

Keywords / Materials (for Non-textual outputs)

  • coils
  • copper
  • electroplating
  • polymers
  • high aspect ratio electroplated copper coils
  • insulating structural layer
  • parylene
  • planar microinductors
  • processing methods

Cite this