Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils

Ross Walker; E. Sirotkin; Ilka Schmueser; J.G. Terry; S. Smith; J.T.M. Stevenson; A.J. Walton

doi:10.1109/ICMTS.2013.6528137

Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils

Ross Walker, E. Sirotkin, Ilka Schmueser, J.G. Terry, S. Smith, J.T.M. Stevenson, A.J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	7-12
Number of pages	6
DOIs	https://doi.org/10.1109/ICMTS.2013.6528137
Publication status	Published - 2013

Keywords

coils
copper
electroplating
polymers
high aspect ratio electroplated copper coils
insulating structural layer
parylene
planar microinductors
processing methods

Access to Document

10.1109/ICMTS.2013.6528137

1 Finished
1 Active

Micro-inductor related collaboration, research & development
Walton, A.
Miscellaneous
1/05/07 → …
Project: Research
SMART microsystems
Walton, A.
EPSRC
1/04/10 → 28/02/15
Project: Research

Cite this

Walker, R., Sirotkin, E., Schmueser, I., Terry, J. G., Smith, S., Stevenson, J. T. M., & Walton, A. J. (2013). Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils. In Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on (pp. 7-12). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ICMTS.2013.6528137

Walker, Ross ; Sirotkin, E. ; Schmueser, Ilka ; Terry, J.G. ; Smith, S. ; Stevenson, J.T.M. ; Walton, A.J. / Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils. Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. Institute of Electrical and Electronics Engineers (IEEE), 2013. pp. 7-12

@inproceedings{9bea56c413084d158ef646e7e7676b05,

title = "Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils",

keywords = "coils, copper, electroplating, polymers, high aspect ratio electroplated copper coils, insulating structural layer, parylene, planar microinductors, processing methods",

author = "Ross Walker and E. Sirotkin and Ilka Schmueser and J.G. Terry and S. Smith and J.T.M. Stevenson and A.J. Walton",

year = "2013",

doi = "10.1109/ICMTS.2013.6528137",

language = "English",

pages = "7--12",

booktitle = "Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

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Walker, R, Sirotkin, E, Schmueser, I , Terry, JG , Smith, S, Stevenson, JTM & Walton, AJ 2013, Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils. in Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. Institute of Electrical and Electronics Engineers (IEEE), pp. 7-12. https://doi.org/10.1109/ICMTS.2013.6528137

Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils. / Walker, Ross; Sirotkin, E.; Schmueser, Ilka ; Terry, J.G.; Smith, S.; Stevenson, J.T.M.; Walton, A.J.

Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. Institute of Electrical and Electronics Engineers (IEEE), 2013. p. 7-12.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils

AU - Walker, Ross

AU - Sirotkin, E.

AU - Schmueser, Ilka

AU - Terry, J.G.

AU - Smith, S.

AU - Stevenson, J.T.M.

AU - Walton, A.J.

PY - 2013

Y1 - 2013

KW - coils

KW - copper

KW - electroplating

KW - polymers

KW - high aspect ratio electroplated copper coils

KW - insulating structural layer

KW - parylene

KW - planar microinductors

KW - processing methods

U2 - 10.1109/ICMTS.2013.6528137

DO - 10.1109/ICMTS.2013.6528137

M3 - Conference contribution

SP - 7

EP - 12

BT - Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on

PB - Institute of Electrical and Electronics Engineers (IEEE)

ER -

Walker R, Sirotkin E, Schmueser I , Terry JG , Smith S, Stevenson JTM et al. Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils. In Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on. Institute of Electrical and Electronics Engineers (IEEE). 2013. p. 7-12 https://doi.org/10.1109/ICMTS.2013.6528137

Characterisation and integration of Parylene as an insulating structural layer for high aspect ratio electroplated copper coils

Keywords

Access to Document

Micro-inductor related collaboration, research & development

SMART microsystems

Cite this