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Original language | English |
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Title of host publication | Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Pages | 7-12 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2013 |
Keywords
- coils
- copper
- electroplating
- polymers
- high aspect ratio electroplated copper coils
- insulating structural layer
- parylene
- planar microinductors
- processing methods