Characterisation of a CMP nanoscale planarisation based process for RF MEMS resonators

S. Enderling, H. Lin, Tom Stevenson, A. S. Bunting, Anthony Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper characterises a novel Chemical Mechanical Polishing (CMP) based process for the fabrication of nanometer wide transducer gaps for RF MEMS resonators. The process requires one photolithographic step less than previously reported fabrication methods and does not suffer from transducer gap widening, which otherwise strongly affects the impedance of manufactured resonators. CMP test masks were used to evaluate the ability to produce nanometer wide planarised capacitive transducer gaps and to determine the planarity of CMP based processing. As a result of this work, pattern dependent removal rates for polysilicon have been determined and design guidelines defined to optimise the yield of CMP fabricated resonators.

Original languageEnglish
Title of host publicationMicro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
EditorsJC Chiao, AS Dzurak, C Jagadish, DV Thiel
Place of PublicationBELLINGHAM
PublisherSPIE
PagesG4150-G4150
Number of pages8
ISBN (Print)978-0-8194-6523-8
DOIs
Publication statusPublished - 2007
EventConference on Micro- and Nanotechnology - Materials, Processes, Packaging, and System III - Adelaide
Duration: 11 Dec 200613 Dec 2006

Conference

ConferenceConference on Micro- and Nanotechnology - Materials, Processes, Packaging, and System III
CityAdelaide
Period11/12/0613/12/06

Keywords

  • chemical mechanical polishing (CMP)
  • radio frequency (RF)
  • micro-electro-mechanical systems (MEMS)
  • resonators
  • fabrication
  • nanoscale
  • transducer gaps

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