Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements

Jeremy Murray; G. Schiavone; S. Smith; J. Terry; Andrew Mount; Anthony Walton

Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements

Jeremy Murray, G. Schiavone, S. Smith, J. Terry, Andrew Mount, Anthony Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Nickel-iron alloys have useful magnetic properties that are of interest to the MEMS industry, but the high stress levels that can develop during the fabrication process pose a real challenge. This paper addresses the characterisation of NiFe films using suspended rotating structures, electrical test structures and X-ray fluorescence measurements. An automated measurement system has been developed, which facilitates rapid wafer mapping to spatially compare stress levels at different stages of the fabrication process. This has been used, together with other wafer mapped parameters such as alloy composition, sheet resistance and layer thickness, to identify correlations and provide an increased understanding of the relationships between the different process control factors.

Original language	English
Title of host publication	2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS)
Place of Publication	NEW YORK
Publisher	Institute of Electrical and Electronics Engineers
Pages	63-68
Number of pages	6
ISBN (Print)	978-1-4244-8527-7
Publication status	Published - 2011
Event	24th IEEE International Conference on Microelectronic Test Structures (ICMTS) - Amsterdam Duration: 4 Apr 2011 → 7 Apr 2011

Conference

Conference	24th IEEE International Conference on Microelectronic Test Structures (ICMTS)
City	Amsterdam
Period	4/04/11 → 7/04/11

Keywords / Materials (for Non-textual outputs)

THIN-FILMS
STRESS
NiFe
Test Structures
electroplating

Cite this

@inproceedings{7ca0d1617da14fa3a820735cfbb876f5,

title = "Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements",

abstract = "Nickel-iron alloys have useful magnetic properties that are of interest to the MEMS industry, but the high stress levels that can develop during the fabrication process pose a real challenge. This paper addresses the characterisation of NiFe films using suspended rotating structures, electrical test structures and X-ray fluorescence measurements. An automated measurement system has been developed, which facilitates rapid wafer mapping to spatially compare stress levels at different stages of the fabrication process. This has been used, together with other wafer mapped parameters such as alloy composition, sheet resistance and layer thickness, to identify correlations and provide an increased understanding of the relationships between the different process control factors.",

keywords = "THIN-FILMS, STRESS, NiFe, Test Structures, electroplating",

author = "Jeremy Murray and G. Schiavone and S. Smith and J. Terry and Andrew Mount and Anthony Walton",

year = "2011",

language = "English",

isbn = "978-1-4244-8527-7",

pages = "63--68",

booktitle = "2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS)",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "24th IEEE International Conference on Microelectronic Test Structures (ICMTS) ; Conference date: 04-04-2011 Through 07-04-2011",

}

Murray, J, Schiavone, G, Smith, S , Terry, J , Mount, A & Walton, A 2011, Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements. in 2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS). Institute of Electrical and Electronics Engineers, NEW YORK, pp. 63-68, 24th IEEE International Conference on Microelectronic Test Structures (ICMTS), Amsterdam, 4/04/11.

Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements. / Murray, Jeremy; Schiavone, G.; Smith, S. et al.
2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS). NEW YORK: Institute of Electrical and Electronics Engineers, 2011. p. 63-68.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements

AU - Murray, Jeremy

AU - Schiavone, G.

AU - Smith, S.

AU - Terry, J.

AU - Mount, Andrew

AU - Walton, Anthony

PY - 2011

Y1 - 2011

N2 - Nickel-iron alloys have useful magnetic properties that are of interest to the MEMS industry, but the high stress levels that can develop during the fabrication process pose a real challenge. This paper addresses the characterisation of NiFe films using suspended rotating structures, electrical test structures and X-ray fluorescence measurements. An automated measurement system has been developed, which facilitates rapid wafer mapping to spatially compare stress levels at different stages of the fabrication process. This has been used, together with other wafer mapped parameters such as alloy composition, sheet resistance and layer thickness, to identify correlations and provide an increased understanding of the relationships between the different process control factors.

AB - Nickel-iron alloys have useful magnetic properties that are of interest to the MEMS industry, but the high stress levels that can develop during the fabrication process pose a real challenge. This paper addresses the characterisation of NiFe films using suspended rotating structures, electrical test structures and X-ray fluorescence measurements. An automated measurement system has been developed, which facilitates rapid wafer mapping to spatially compare stress levels at different stages of the fabrication process. This has been used, together with other wafer mapped parameters such as alloy composition, sheet resistance and layer thickness, to identify correlations and provide an increased understanding of the relationships between the different process control factors.

KW - THIN-FILMS

KW - STRESS

KW - NiFe

KW - Test Structures

KW - electroplating

UR - http://www.scopus.com/inward/record.url?scp=80052425492&partnerID=8YFLogxK

M3 - Conference contribution

SN - 978-1-4244-8527-7

SP - 63

EP - 68

BT - 2011 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS)

PB - Institute of Electrical and Electronics Engineers

CY - NEW YORK

T2 - 24th IEEE International Conference on Microelectronic Test Structures (ICMTS)

Y2 - 4 April 2011 through 7 April 2011

ER -

Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements

Abstract

Conference

Keywords / Materials (for Non-textual outputs)

Other files and links

Fingerprint

SMART microsystems

manufacturability of Monolithic, Ferromagentic Core, Power Inductors

RCUK Fellowship

Cite this

Characterisation of Electroplated NiFe Films using Test Structures and Wafer Mapped Measurements

Abstract

Conference

Keywords / Materials (for Non-textual outputs)

Other files and links

Fingerprint

Projects

SMART microsystems

manufacturability of Monolithic, Ferromagentic Core, Power Inductors

RCUK Fellowship

Cite this