Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures

Jeremy Murray, Richard Perry, Jonathan Terry, Stewart Smith, Andrew Mount, Anthony Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform.
Original languageEnglish
Title of host publicationProceedings of IEEE International Conference on Microelectronic Test Structures
Pages178-183
Number of pages6
Publication statusPublished - 29 Mar 2016

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  • SMART microsystems

    Walton, A.

    EPSRC

    1/04/1028/02/15

    Project: Research

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