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This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform.
|Title of host publication||Proceedings of IEEE International Conference on Microelectronic Test Structures|
|Number of pages||6|
|Publication status||Published - 29 Mar 2016|