Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures

Jeremy Murray; Richard Perry; Jonathan Terry; Stewart Smith; Andrew Mount; Anthony Walton

Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures

Jeremy Murray, Richard Perry, Jonathan Terry, Stewart Smith, Andrew Mount, Anthony Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform.

Original language	English
Title of host publication	Proceedings of IEEE International Conference on Microelectronic Test Structures
Pages	178-183
Number of pages	6
Publication status	Published - 29 Mar 2016

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Chip electroplate_murrayAccepted author manuscript, 477 KB

SMART microsystems
Walton, A. (Principal Investigator)
EPSRC
1/04/10 → 28/02/15
Project: Research

Data for "Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures"
Murray, J. (Creator) & Walton, A. (Creator), Edinburgh DataShare, 8 Feb 2016
DOI: 10.7488/ds/1337
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title = "Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures",

abstract = "This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform. ",

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AU - Murray, Jeremy

AU - Perry, Richard

AU - Terry, Jonathan

AU - Smith, Stewart

AU - Mount, Andrew

AU - Walton, Anthony

PY - 2016/3/29

Y1 - 2016/3/29

N2 - This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform.

AB - This paper describes the first use of test structure chips being used to characterise the fundamental properties of Ni and NiFe alloy films deposited using electroplating. This approach is used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited Ni and NiFe layers. The advantage of this approach is that each electrolyte change does not require the replacement of a 35 litre bath (which is necessary for wafer level investigations), thereby making each experiment less time consuming and considerably cheaper to perform.

M3 - Conference contribution

SP - 178

EP - 183

BT - Proceedings of IEEE International Conference on Microelectronic Test Structures

ER -

Chip level characterisation studies of Ni and NiFe electrochemical deposition using test structures

Abstract

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