Correlation of optical and electrical test structures for characterisation of copper self-annealing

J. Murray; S. Smith; G. Schiavone; J.G. Terry; A.R. Mount; A.J. Walton

doi:10.1109/ICMTS.2012.6190635

Correlation of optical and electrical test structures for characterisation of copper self-annealing

J. Murray, S. Smith, G. Schiavone, J.G. Terry, A.R. Mount, A.J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The self-annealing properties at room temperature of electrochemically deposited copper have been investigated for the first time using test structures to simultaneously measure the spatial variation of sheet resistance and film stress with time. The phase changes associated with the self-annealing of copper on 200mm wafers have been observed over a period of 30 hours indirectly through these parameters, mapped across the wafer. In particular, this paper reports the influence of the electroplating current density on the resulting characteristics of the deposited copper.

Original language	English
Title of host publication	Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
Pages	152 -158
DOIs	https://doi.org/10.1109/ICMTS.2012.6190635
Publication status	Published - 1 Mar 2012

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10.1109/ICMTS.2012.6190635

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3 Finished

SMART microsystems
Walton, A.
EPSRC
1/04/10 → 28/02/15
Project: Research
manufacturability of Monolithic, Ferromagentic Core, Power Inductors
Walton, A.
Non-EU industry, commerce and public corporations
1/12/06 → 30/11/11
Project: Research
RCUK Fellowship
Smith, S., Anderton, S., Bagnaninchi, P., Blythe, R., Calvert, J., Downes, A., Frame, M., Hay, D., Popovic, N. & Rambaut, A.
EPSRC, STFC
1/10/06 → 30/06/13
Project: Research

Cite this

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Correlation of optical and electrical test structures for characterisation of copper self-annealing

Abstract

Access to Document

SMART microsystems

manufacturability of Monolithic, Ferromagentic Core, Power Inductors

RCUK Fellowship

Cite this