Design and Simulation of a 2-Bit Distributed S-band MEMS Phase Shifter

Noor Amalina Ramli*, Tughrul Arslan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a wideband distributed coplanar waveguide (CPW) phase shifter has been designed for S-band operation. The phase shifter is developed on a high impedance CPW transmission line periodically loaded with microelectro-mechanical system (MEMS) shunt switches. To reduce the insertion loss due to the transmission line, a 525 mu m high resistivity silicon substrate (rho= 10 k Omega-cm) and 2 mu m thick aluminium center conductor are used. A large metal-insulator-metal (MIM) capacitor is implemented on the CPW center conductor between the two bits to separate the DC actuation voltage during operation. There are 41 MEMS shunt switches utilised in the design. The simulated retlection coefficients are less than - 10 dB from 2 to 4 GHz for all 4 states (0 degrees, 90 degrees, 180 degrees and 270 degrees). The simulated average insertion loss at 2.45 GHz is 1.69 dB. The size of the phase shifter has been optimized by employing 60 degrees mitered CPW bends to result in overall size of 11. 62 mm x 28.35 mm. The simulated pull-in voltage of the fixed-fixed beams implemented in the design is 9.68 V. The true time delay characteristic of the phase shifter makes it suitable for use in smart antenna applications, radar systems and ultrawideband (UWB) microwave imaging.

Original languageEnglish
Title of host publication2017 18TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME)
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages5
Publication statusPublished - 2017
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Conference

Conference18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Country/TerritoryGermany
CityDresden
Period3/04/175/04/17

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