Design, fabrication, and testing of 3C-SiC sensors for high-temperature applications

M. Pozzi; A. J. Harris; J. S. Burdess; G. J. Phelps; N. G. Wright; P. Argyrakis; K. K. Lee; R. Cheung

Design, fabrication, and testing of 3C-SiC sensors for high-temperature applications

M. Pozzi, A. J. Harris, J. S. Burdess, G. J. Phelps, N. G. Wright, P. Argyrakis, K. K. Lee, R. Cheung

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	Undefined/Unknown
Title of host publication	Proceedings of SPIE Conference on Microelectronics, MEMS and Nanotechnology
Publication status	Published - 2007

Cite this

@inproceedings{fabbf38272e5487484a12252c013a0e1,

title = "Design, fabrication, and testing of 3C-SiC sensors for high-temperature applications",

author = "M. Pozzi and Harris, \{A. J.\} and Burdess, \{J. S.\} and Phelps, \{G. J.\} and Wright, \{N. G.\} and P. Argyrakis and Lee, \{K. K.\} and R. Cheung",

year = "2007",

language = "Undefined/Unknown",

booktitle = "Proceedings of SPIE Conference on Microelectronics, MEMS and Nanotechnology",

}

TY - GEN

T1 - Design, fabrication, and testing of 3C-SiC sensors for high-temperature applications

AU - Pozzi, M.

AU - Harris, A. J.

AU - Burdess, J. S.

AU - Phelps, G. J.

AU - Wright, N. G.

AU - Argyrakis, P.

AU - Lee, K. K.

AU - Cheung, R.

PY - 2007

Y1 - 2007

M3 - Conference contribution

BT - Proceedings of SPIE Conference on Microelectronics, MEMS and Nanotechnology

ER -