Projects per year
Abstract / Description of output
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an electrochemical impedance sensor, and Complementary Metal Oxide Semiconductor (CMOS) die. Both are drawn from an MPW batch, thinned at die-level after dicing and singulation down to 60 µm. The thinned dies were flip-chip bonded to flexible substrates and hermetically sealed by two techniques: thermosonic bonding of Au stud bumps and anisotropic conductive paste (ACP) bonding. The performance of the thinned dies was assessed via functional tests and compared to the original dies. Furthermore, the long-term reliability of the flip-chip bonded thinned sensors was demonstrated to be higher than the conventional wire-bonded sensors.
Original language | English |
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Article number | 849 |
Journal | Electronics |
Volume | 11 |
Issue number | 6 |
Early online date | 8 Mar 2022 |
DOIs | |
Publication status | E-pub ahead of print - 8 Mar 2022 |
Keywords / Materials (for Non-textual outputs)
- ultra-thin-chips
- multi-project wafers
- hybrid integration
- thermoconic flip chip
- anisotropic conductive adhesives
- Flexible electronics
- flip chip bonding
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Dive into the research topics of 'Die-Level Thinning for Flip-Chip Integration on Flexible Substrates'. Together they form a unique fingerprint.Projects
- 1 Finished
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ENLIGHTEM: European Training Network in Low-energy Visible Light IoT Systems
Haas, H. & Popoola, W.
1/06/19 → 31/05/23
Project: Research