Dynamic Thermal Rating of a Modular Multilevel Converter HVDC Link with Overload Capacity

P. D. Judge, T. C. Green

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract / Description of output

The power rating of Modular Multilevel Converter based HVDC has increased rapidly over the past decade, with individual links in the gigawatt power range now technically feasible and further power increases on the horizon. Such large links may be required to provide ancillary services such as fast frequency response or emergency power re-routing in the event of a system disturbance. Providing such services may require converters to be designed with overload capacity. This paper examines how the thermal aspects of semiconductor devices may impact the operation of such converters and how the exploitation of short-term thermal dynamics may lead to dynamic overload rating.
Original languageUndefined/Unknown
Title of host publication2015 IEEE Eindhoven PowerTech
Pages1-6
Number of pages6
DOIs
Publication statusPublished - 1 Jun 2015

Keywords / Materials (for Non-textual outputs)

  • HVDC power convertors
  • Transient analysis
  • HVDC power transmission
  • power system disturbance
  • power system faults
  • HVDC transmission
  • Converters
  • Insulated gate bipolar transistors
  • semiconductor devices
  • ancillary service
  • modular multilevel converter HVDC link dynamic thermal rating
  • overload capacity
  • semiconductor device
  • short-term thermal dynamics
  • Heating
  • Junctions
  • Temperature
  • Frequency response
  • Thermal management of electronics

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