Effect of ambient temperature and relative humidity on interfacial temperature during early stages of drop evaporation

Yuki Fukatani, kita Yutaku, Daniel Orejon*, Yasuyuki Takata, J. Kim, Khellil Sefiane

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Understanding drop evaporation mechanisms is important for many industrial, biological, and other applications. Drops of organic solvents undergoing evaporation have been found to display distinct thermal patterns, which in turn depend on the physical properties of the liquid, the substrate, and ambient conditions. These patterns have been reported previously to be bulk patterns from the solid-liquid to the liquid-gas drop interface. In the present work the effect of ambient temperature and humidity during the first stage of evaporation, i.e., pinned contact line, is studied paying special attention to the thermal information retrieved at the liquid-gas interface through IR thermography. This is coupled with drop profile monitoring to experimentally investigate the effect of ambient temperature and relative humidity on the drop interfacial thermal patterns and the evaporation rate. Results indicate that self-generated thermal patterns are enhanced by an increase in ambient temperature and/or a decrease in humidity. The more active thermal patterns observed at high ambient temperatures are explained in light of a greater temperature difference generated between the apex and the edge of the drop due to greater evaporative cooling. On the other hand, the presence of water humidity in the atmosphere is found to decrease the temperature difference along the drop interface due to the heat of adsorption, absorption and/or that of condensation of water onto the ethanol drops. The control, i.e., enhancement or suppression, of these thermal patterns at the drop interface by means of ambient temperature and relative humidity is quantified and reported.
Original languageEnglish
Article number043103
Number of pages16
JournalPhysical Review E
Issue number4
Publication statusPublished - 1 Apr 2016


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