Effects of parylene-C photooxidation on serum-assisted glial and neuronal patterning

Evangelos Delivopoulos, Alan F. Murray, John C. Curtis

Research output: Contribution to journalArticlepeer-review


The increasing use of patterned neural networks in multielectrode arrays and similar devices drives the constant development and evaluation of new biomaterials. Recently, we presented a promising technique to guide neurons and glia reliably and effectively. Parylene-C, a common hydrophobic polymer, was photolithographically patterned on silicon oxide (SiO2) and subsequently activated via immersion in serum. In this article, we explore the effects of ultraviolet (UV)-induced oxidation on parylene's ability to pattern neurons and glia. We exposed parylene-C stripe patterns to increasing levels of UV radiation and found a dose-dependent reduction in the total mass of patterned cells, as well as a gradual loss of glial and neuronal conformity to the patterns. In contrast, nonirradiated patterns had superior patterning results and increased presence of cells. The reduced cell adhesion and patterning after the formation of aldehyde and carboxyl groups on UV-radiated parylene-C supports our hypothesis that cell adhesion and growth on parylene is facilitated by hydrophobic adsorption of serum proteins. We conclude that unlike other cell patterning schemes, our technique does not rely on photooxidation of the polymer. Nonetheless, the precise control of oxygenated groups on parylene could pave the way for the differential binding of proteins and other molecules on the surface, aiding in the adhesion of alternative cell types. (C) 2010 Wiley Periodicals, Inc. J Biomed Mater Res 94A: 47-58, 2010

Original languageEnglish
Pages (from-to)47-58
Number of pages12
JournalJournal of Biomedical Materials Research Part A
Issue number1
Publication statusPublished - Jul 2010


Dive into the research topics of 'Effects of parylene-C photooxidation on serum-assisted glial and neuronal patterning'. Together they form a unique fingerprint.

Cite this