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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
S. Costello, N. Strusevich*, D. Flynn, R. W. Kay, M. K. Patel, C. Bailey, D. Price, M. Bennet, A. C. Jones, M. P. Y. Desmulliez
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review