Fabrication of silicon microchannel with integrated heater and temperature sensors for flow boiling studies

S. Gedupudi, G. P. Cummins, H. Lin, Anthony Walton, K. Sefiane, T. G. Karayiannis, D. B. R. Kenning

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two-phase microchannel heat sinks are a promising solution to meet the requirements for cooling electronic components with high-density heat dissipation. However, their design requires a thorough understanding of flow boiling and pressure drop in microchannels.

The channels described in this paper have been fabricated in silicon, with rectangular cross-sections ranging in hydraulic diameter between 0.62 and 0.1 mm, for studies of boiling in single channels. To facilitate visualisation, the top of each channel is covered with Pyrex 7740, predrilled for fluid inlet and outlet connections. Integrated tantalum resistors are located uniformly along the bottom of the channel for temperature sensing. Tantalum pentoxide and PECVD silicon dioxide (which also conformally coats the channel walls) are used to electrically insulate the sensor from any liquid in the channel. The heater is an integrated aluminium serpentine track on the back of the bottom wafer. The channel is etched down to the sensors on the bonded bottom silicon wafer using the Bosch process.

The objective related to the development of these silicon microchannels is to achieve heat fluxes of 2 MW m(-2) with low, near-uniform wall superheat (by means of bubble triggering and artificial nucleation sites). Experiments will be carried out with mass fluxes varying from 100 to 500 kg(-2) s(-1), using de-ionized water and an organic fluid as the working fluids.

Original languageEnglish
Title of host publicationPROCEEDINGS OF THE MICRO/NANOSCALE HEAT TRANSFER INTERNATIONAL CONFERENCE 2008, PTS A AND B
Place of PublicationNEW YORK
PublisherAmerican Society for Mechanical Engineers
Pages747-753
Number of pages7
ISBN (Print)978-0-7918-4292-8
Publication statusPublished - 2008
Event1st ASME Micro/Nanoscale Heat Transfer International Conference - Tainan
Duration: 6 Jan 20089 Jan 2008

Conference

Conference1st ASME Micro/Nanoscale Heat Transfer International Conference
CityTainan
Period6/01/089/01/08

Keywords

  • flow boiling
  • microchannel
  • temperature sensor
  • sensitivity
  • heater
  • etching
  • anodic bonding
  • fusion bonding
  • CHANNEL
  • FILMS

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