Fabrication of Test Structures to Monitor Stress in SU-8 Films used for MEMS Applications

S. Smith, N. L. Brockie, J. Murray, C. J. Wilson, A. B. Horsfall, Jonathan Terry, Tom Stevenson, Andrew Mount, Anthony Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

SU-8, an epoxy based negative photoresist, is widely used in the manufacture of micromechanical systems but can exhibit significant levels of stress build-up during processing. This paper describes micromechanical test structures that provide the opportunity to spatially characterise stress the in SU-8 at different stages of the process. The structures are fabricated in a thick layer of SU-8 and are subsequently released from the underlying substrate using a dry chemical vapour etch process. The initial results indicate that there is significant tensile stress in the SU-8, and that this demonstrates a radial variation along with a dependence on the process conditions.

Original languageEnglish
Title of host publication2010 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, 23RD IEEE ICMTS CONFERENCE PROCEEDINGS
Place of PublicationNEW YORK
PublisherInstitute of Electrical and Electronics Engineers
Pages813
Number of pages6
ISBN (Print)978-1-4244-6915-4
Publication statusPublished - 2010
Event23rd International Conference on Microelectronic Test Structures (ICMTS) - Hiroshima
Duration: 22 Mar 201025 Mar 2010

Conference

Conference23rd International Conference on Microelectronic Test Structures (ICMTS)
CityHiroshima
Period22/03/1025/03/10

Keywords / Materials (for Non-textual outputs)

  • THIN-FILMS

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