Improving the flatness of silicon backplanes for high quality FLCoS microdisplays

C. Miremont, G. Bodammer, D. Calton, W. Parkes, W. Zheng, I. Underwood

Research output: Contribution to journalArticlepeer-review

Abstract / Description of output

The flatness of silicon backplanes for ferroelectric liquid crystal microdisplays is essential for their commercial success. The various factors affecting the flatness of liquid crystal on silicon backplanes are reviewed. A flattening technique is proposed based on a promising method that employs induced stress of thin films to control the deformation of silicon wafer. Limitations of this technique are discussed.
Original languageUndefined/Unknown
Pages (from-to)5
Number of pages1
Issue number3
Publication statusPublished - 19 Mar 2002

Keywords / Materials (for Non-textual outputs)

  • FLCoS microdisplays
  • Silicon backplane
  • Chemical–mechanical-polishing
  • Flattening

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