Improving the flatness of silicon backplanes for high quality FLCoS microdisplays

C. Miremont; G. Bodammer; D. Calton; W. Parkes; W. Zheng; I. Underwood

doi:10.1016/S0141-9382(02)00017-3

Improving the flatness of silicon backplanes for high quality FLCoS microdisplays

C. Miremont
, G. Bodammer
, D. Calton
, W. Parkes
, W. Zheng
, I. Underwood

School of Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The flatness of silicon backplanes for ferroelectric liquid crystal microdisplays is essential for their commercial success. The various factors affecting the flatness of liquid crystal on silicon backplanes are reviewed. A flattening technique is proposed based on a promising method that employs induced stress of thin films to control the deformation of silicon wafer. Limitations of this technique are discussed.

Original language	Undefined/Unknown
Pages (from-to)	5
Number of pages	1
Journal	Displays
Volume	23
Issue number	3
DOIs	https://doi.org/10.1016/S0141-9382(02)00017-3
Publication status	Published - 19 Mar 2002

Keywords / Materials (for Non-textual outputs)

FLCoS microdisplays
Silicon backplane
Chemical–mechanical-polishing
Flattening

Access to Document

10.1016/S0141-9382(02)00017-3

Cite this

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title = "Improving the flatness of silicon backplanes for high quality FLCoS microdisplays",

abstract = "The flatness of silicon backplanes for ferroelectric liquid crystal microdisplays is essential for their commercial success. The various factors affecting the flatness of liquid crystal on silicon backplanes are reviewed. A flattening technique is proposed based on a promising method that employs induced stress of thin films to control the deformation of silicon wafer. Limitations of this technique are discussed.",

keywords = "FLCoS microdisplays, Silicon backplane, Chemical–mechanical-polishing, Flattening",

author = "C. Miremont and G. Bodammer and D. Calton and W. Parkes and W. Zheng and I. Underwood",

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T1 - Improving the flatness of silicon backplanes for high quality FLCoS microdisplays

AU - Miremont, C.

AU - Bodammer, G.

AU - Calton, D.

AU - Parkes, W.

AU - Zheng, W.

AU - Underwood, I.

PY - 2002/3/19

Y1 - 2002/3/19

N2 - The flatness of silicon backplanes for ferroelectric liquid crystal microdisplays is essential for their commercial success. The various factors affecting the flatness of liquid crystal on silicon backplanes are reviewed. A flattening technique is proposed based on a promising method that employs induced stress of thin films to control the deformation of silicon wafer. Limitations of this technique are discussed.

AB - The flatness of silicon backplanes for ferroelectric liquid crystal microdisplays is essential for their commercial success. The various factors affecting the flatness of liquid crystal on silicon backplanes are reviewed. A flattening technique is proposed based on a promising method that employs induced stress of thin films to control the deformation of silicon wafer. Limitations of this technique are discussed.

KW - FLCoS microdisplays

KW - Silicon backplane

KW - Chemical–mechanical-polishing

KW - Flattening

U2 - 10.1016/S0141-9382(02)00017-3

DO - 10.1016/S0141-9382(02)00017-3

M3 - Article

SN - 0141-9382

VL - 23

SP - 5

JO - Displays

JF - Displays

IS - 3

ER -