Integration of IC technology with MEMS: Silicon+ technology for the future

A J Walton; J T M Stevenson; I Underwood; J.G. Terry; S Smith; W Parkes; C Dunare; H Lin; Y Li; R Henderson; D Renshaw; K. Muir; M Desmulliez; D. Flynn; M.J. MacIntosh; W.S. Holland; A.F. Murray; T.B. Tang; A Bunting; A M Gundlach

Integration of IC technology with MEMS: Silicon+ technology for the future

A J Walton
, J T M Stevenson
, I Underwood
, J.G. Terry
, S Smith
, W Parkes
, C Dunare
, H Lin
, Y Li
, R Henderson
, D Renshaw
, K. Muir
, M Desmulliez
, D. Flynn
, M.J. MacIntosh
, W.S. Holland
, A.F. Murray
, T.B. Tang
, A Bunting
, A M Gundlach

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Micro Electro-Mechanical Systems, 2007. MEMS Technology. 2007 IET Seminar on
Pages	1-11
Number of pages	11
Publication status	Published - 2007

Cite this

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J. G., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A., & Gundlach, A. M. (2007). Integration of IC technology with MEMS: Silicon+ technology for the future. In Micro Electro-Mechanical Systems, 2007. MEMS Technology. 2007 IET Seminar on (pp. 1-11)

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title = "Integration of IC technology with MEMS: Silicon+ technology for the future",

author = "Walton, \{A J\} and Stevenson, \{J T M\} and I Underwood and J.G. Terry and S Smith and W Parkes and C Dunare and H Lin and Y Li and R Henderson and D Renshaw and K. Muir and M Desmulliez and D. Flynn and M.J. MacIntosh and W.S. Holland and A.F. Murray and T.B. Tang and A Bunting and Gundlach, \{A M\}",

year = "2007",

language = "English",

pages = "1--11",

booktitle = "Micro Electro-Mechanical Systems, 2007. MEMS Technology. 2007 IET Seminar on",

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Walton, AJ, Stevenson, JTM, Underwood, I , Terry, JG , Smith, S, Parkes, W, Dunare, C, Lin, H, Li, Y, Henderson, R, Renshaw, D, Muir, K, Desmulliez, M, Flynn, D, MacIntosh, MJ, Holland, WS, Murray, AF, Tang, TB, Bunting, A & Gundlach, AM 2007, Integration of IC technology with MEMS: Silicon+ technology for the future. in Micro Electro-Mechanical Systems, 2007. MEMS Technology. 2007 IET Seminar on. pp. 1-11.

TY - GEN

T1 - Integration of IC technology with MEMS: Silicon+ technology for the future

AU - Walton, A J

AU - Stevenson, J T M

AU - Underwood, I

AU - Terry, J.G.

AU - Smith, S

AU - Parkes, W

AU - Dunare, C

AU - Lin, H

AU - Li, Y

AU - Henderson, R

AU - Renshaw, D

AU - Muir, K.

AU - Desmulliez, M

AU - Flynn, D.

AU - MacIntosh, M.J.

AU - Holland, W.S.

AU - Murray, A.F.

AU - Tang, T.B.

AU - Bunting, A

AU - Gundlach, A M

PY - 2007

Y1 - 2007

M3 - Conference contribution

SP - 1

EP - 11

BT - Micro Electro-Mechanical Systems, 2007. MEMS Technology. 2007 IET Seminar on

ER -