Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

H. Yuan, J. F. Chen, J. G. Teng, X. Z. Lu

Research output: Contribution to journalArticlepeer-review

Abstract

The so-called peel test, in which a thin plate bonded to a substrate is subjected to an inclined pulling force, has been widely used to characterise the bond behaviour of adhesives. This paper presents an analytical solution for the interfacial normal and shear stresses in such a peel test to provide an improved understanding of its underlying mechanism. An approximate closed-form solution is also presented. The effect of the peel angle (i.e. the angle between the applied force and the substrate) on the interfacial stresses is discussed. Apart from being a widely used test for quantifying adhesive characteristics, the process of debonding in a peel test resembles that of intermediate flexural-shear or shear crack induced debonding in flexurally strengthened RC members, where a relative vertical displacement exists between the two sides of the crack, leading to an angle between the external plate and the concrete substrate. Therefore, the results of this study also offer some insight into the latter failure mode which is very important in the flexural strengthening design of RC members. (c) 2006 Elsevier Ltd. All rights reserved.

Original languageEnglish
Pages (from-to)5247-5271
Number of pages25
JournalInternational Journal of Solids and Structures
Volume44
Issue number16
DOIs
Publication statusPublished - 1 Aug 2007

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