Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films

G. Cummins, H. Lin, Anthony Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper details the optimization and characterization of an anodic bonding process for glass to dielectric thin films. Test structures suitable for non destructive, in-situ measurement of the bond strength at the interface have been used to determine the uniformity and quality of the bond.

Original languageEnglish
Title of host publication2008 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, CONFERENCE PROCEEDINGS
Place of PublicationNEW YORK
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages111-116
Number of pages6
ISBN (Print)978-1-4244-1800-8
Publication statusPublished - 2008
EventIEEE International Conference on Microelectronic Test Structures - Edinburgh
Duration: 24 Mar 200827 Mar 2008

Conference

ConferenceIEEE International Conference on Microelectronic Test Structures
CityEdinburgh
Period24/03/0827/03/08

Keywords

  • SILICON-NITRIDE
  • POLYSILICON
  • WAFERS
  • OXIDE

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