Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture

R.W. Kay, G. Cummins, M.P.Y. Desmulliez, J. Terry, A.J. Walton

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract / Description of output

This article reports the silver paste printing onto LTCC substrates at sub-100μm linewidths using a microengineered electroformed dual layer stencil. It is demonstrated that such a stencil can serve as a screen replacement and print tracks of line widths down to 40μms with a gap of 25μm. Two commercially available Ag pastes designed for either screen printing tracks or stencil printing vias were analyzed to gain insight into what material properties are best suited for fine line printing using a dual layer stencil. It is shown that the same stencil and paste material can be used to fill in vias down to 200μm diameter for ceramic green tapes of 50μm thickness indicating that these line printing and via filling processes could be combined, allowing thereby increased throughput, resolution and registration benefit in LTCC manufacture.
Original languageEnglish
Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Number of pages6
Publication statusPublished - 1 Jan 2011


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