TY - CHAP
T1 - Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture
AU - Kay, R.W.
AU - Cummins, G.
AU - Desmulliez, M.P.Y.
AU - Terry, J.
AU - Walton, A.J.
PY - 2011/1/1
Y1 - 2011/1/1
N2 - This article reports the silver paste printing onto LTCC substrates at sub-100μm linewidths using a microengineered electroformed dual layer stencil. It is demonstrated that such a stencil can serve as a screen replacement and print tracks of line widths down to 40μms with a gap of 25μm. Two commercially available Ag pastes designed for either screen printing tracks or stencil printing vias were analyzed to gain insight into what material properties are best suited for fine line printing using a dual layer stencil. It is shown that the same stencil and paste material can be used to fill in vias down to 200μm diameter for ceramic green tapes of 50μm thickness indicating that these line printing and via filling processes could be combined, allowing thereby increased throughput, resolution and registration benefit in LTCC manufacture.
AB - This article reports the silver paste printing onto LTCC substrates at sub-100μm linewidths using a microengineered electroformed dual layer stencil. It is demonstrated that such a stencil can serve as a screen replacement and print tracks of line widths down to 40μms with a gap of 25μm. Two commercially available Ag pastes designed for either screen printing tracks or stencil printing vias were analyzed to gain insight into what material properties are best suited for fine line printing using a dual layer stencil. It is shown that the same stencil and paste material can be used to fill in vias down to 200μm diameter for ceramic green tapes of 50μm thickness indicating that these line printing and via filling processes could be combined, allowing thereby increased throughput, resolution and registration benefit in LTCC manufacture.
UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84860894455&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2011.6184473
DO - 10.1109/EPTC.2011.6184473
M3 - Chapter
AN - SCOPUS:84860894455
SN - 9781457719837
SP - 507
EP - 512
BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
ER -