Abstract
This paper details the design, fabrication and characterisation of a piezoresistive membrane deflection test structure for the electrical evaluation of hermeticity in low cavity volume package. This test structure uses the O-Ievel silicon cap, defined in the MultiMEMS foundry service, as a deflecting membrane to electrically monitor changes in package cavity pressure over time. The hermeticity of the package can then be determined in real-time and low leak rates can be measured using a pressurisation stage, which also accelerates the test. The minimum detectable leak rate of the test structure without test acceleration is 6.9x10(-12) atm.cm(3).s(-1), which is two orders of magnitude lower than the limit of the traditional helium fine leak test method.
| Original language | English |
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| Title of host publication | 2012 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS) |
| Place of Publication | NEW YORK |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 45-49 |
| Number of pages | 5 |
| ISBN (Print) | 978-1-4673-1028-4 |
| Publication status | Published - 2012 |
| Event | IEEE International Conference on Microelectronic Test Structures (ICMTS) - San Diego Duration: 20 Mar 2012 → 22 Mar 2012 |
Conference
| Conference | IEEE International Conference on Microelectronic Test Structures (ICMTS) |
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| City | San Diego |
| Period | 20/03/12 → 22/03/12 |