Progress towards filling through silicon vias with conductive ink

G. Cummins; J.H.-G. Ng; R. Kay; J.G. Terry; M.P.Y. Desmulliez; A.J. Walton

doi:10.1109/EPTC.2012.6507170

Progress towards filling through silicon vias with conductive ink

G. Cummins, J.H.-G. Ng, R. Kay, J.G. Terry, M.P.Y. Desmulliez, A.J. Walton

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

Original language	English
Title of host publication	Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages	691-694
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2012.6507170
Publication status	Published - 1 Jan 2012

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Progress towards filling through silicon vias with conductive ink

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