Progress towards filling through silicon vias with conductive ink

G. Cummins, J.H.-G. Ng, R. Kay, J.G. Terry, M.P.Y. Desmulliez, A.J. Walton

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract / Description of output

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.
Original languageEnglish
Title of host publicationProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages691-694
Number of pages4
DOIs
Publication statusPublished - 1 Jan 2012

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