Refueling: Preventing Wire Degradation due to Electromigration

Jaume Abella; Xavier Vera; Osman S. Unsal; Oguz Ergin; Antonio González; James W. Tschanz

doi:10.1109/MM.2008.92

Refueling: Preventing Wire Degradation due to Electromigration

Jaume Abella, Xavier Vera, Osman S. Unsal, Oguz Ergin, Antonio González, James W. Tschanz

Research output: Contribution to journal › Article › peer-review

Abstract

Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.

Original language	English
Pages (from-to)	37-46
Number of pages	10
Journal	IEEE Micro
Volume	28
Issue number	6
DOIs	https://doi.org/10.1109/MM.2008.92
Publication status	Published - 2008

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10.1109/MM.2008.92

http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4731173

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title = "Refueling: Preventing Wire Degradation due to Electromigration",

abstract = "Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.",

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AU - Vera, Xavier

AU - Unsal, Osman S.

AU - Ergin, Oguz

AU - González, Antonio

AU - Tschanz, James W.

PY - 2008

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AB - Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.

U2 - 10.1109/MM.2008.92

DO - 10.1109/MM.2008.92

M3 - Article

VL - 28

SP - 37

EP - 46

JO - IEEE Micro

JF - IEEE Micro

SN - 0272-1732

IS - 6

ER -

Refueling: Preventing Wire Degradation due to Electromigration

Abstract

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