Abstract
Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.
Original language | English |
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Pages (from-to) | 37-46 |
Number of pages | 10 |
Journal | IEEE Micro |
Volume | 28 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2008 |