Refueling: Preventing Wire Degradation due to Electromigration

Jaume Abella, Xavier Vera, Osman S. Unsal, Oguz Ergin, Antonio González, James W. Tschanz

Research output: Contribution to journalArticlepeer-review

Abstract

Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.
Original languageEnglish
Pages (from-to)37-46
Number of pages10
JournalIEEE Micro
Volume28
Issue number6
DOIs
Publication statusPublished - 2008

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