Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

R.W. Kay; G. Cummins; J.H.-G. Ng; J.G. Terry; M.P.Y. Desmulliez; A.J. Walton

doi:10.1109/EPTC.2012.6507042

Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

R.W. Kay, G. Cummins, J.H.-G. Ng, J.G. Terry, M.P.Y. Desmulliez, A.J. Walton

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

This article reports the results obtained by screen printing through a microengineered electroformed nickel screen to successfully fill TSVs and print a redistribution layer on Si wafers. Redistribution lines were deposited down to 40μm width at 70μm pitch. Straight through hole sections on the microengineered screen formed a stencil / screen hybrid region enabling TSVs to be filled down to 8.5:1 aspect ratio. However multiple print passes were required to completely fill the vias. Rheological properties of the printing medium play a major impact on the print printing performance.

Original language	English
Title of host publication	Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages	14-18
Number of pages	5
DOIs	https://doi.org/10.1109/EPTC.2012.6507042
Publication status	Published - 1 Jan 2012

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10.1109/EPTC.2012.6507042

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Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

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