Test structures for characterizing a damascene CMP interconnect process

C. M. Peyne; A. O'Hara; J. T.M. Stevenson; J. P. Elliott; A. J. Walton; M. Fallon

Test structures for characterizing a damascene CMP interconnect process

C. M. Peyne^*, A. O'Hara, J. T.M. Stevenson, J. P. Elliott, A. J. Walton, M. Fallon

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents some test structure that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.

Original language	English
Pages	151-155
Number of pages	5
Publication status	Published - 1 Jan 1997
Event	Proceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS - Monterey, CA, USA Duration: 17 Mar 1997 → 20 Mar 1997

Conference

Conference	Proceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS
City	Monterey, CA, USA
Period	17/03/97 → 20/03/97

Cite this

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title = "Test structures for characterizing a damascene CMP interconnect process",

abstract = "This paper presents some test structure that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.",

author = "Peyne, {C. M.} and A. O'Hara and Stevenson, {J. T.M.} and Elliott, {J. P.} and Walton, {A. J.} and M. Fallon",

year = "1997",

month = jan,

day = "1",

language = "English",

pages = "151--155",

note = "Proceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS ; Conference date: 17-03-1997 Through 20-03-1997",

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T1 - Test structures for characterizing a damascene CMP interconnect process

AU - Peyne, C. M.

AU - O'Hara, A.

AU - Stevenson, J. T.M.

AU - Elliott, J. P.

AU - Walton, A. J.

AU - Fallon, M.

PY - 1997/1/1

Y1 - 1997/1/1

N2 - This paper presents some test structure that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.

AB - This paper presents some test structure that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.

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M3 - Paper

AN - SCOPUS:0030649520

SP - 151

EP - 155

T2 - Proceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS

Y2 - 17 March 1997 through 20 March 1997

ER -

Test structures for characterizing a damascene CMP interconnect process

Abstract

Conference

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