Test structures for characterizing a damascene CMP interconnect process

C. M. Peyne*, A. O'Hara, J. T.M. Stevenson, J. P. Elliott, A. J. Walton, M. Fallon

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

Abstract

This paper presents some test structure that can be used to help characterize interconnect fabricated using a CMP damascene process. Electrical measurements of the test structures are compared with those obtained using an AFM and surface profiling.

Original languageEnglish
Pages151-155
Number of pages5
Publication statusPublished - 1 Jan 1997
EventProceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS - Monterey, CA, USA
Duration: 17 Mar 199720 Mar 1997

Conference

ConferenceProceedings of the 1997 IEEE International Conference on Microelectronic Test Structures, ICMTS
CityMonterey, CA, USA
Period17/03/9720/03/97

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