Projects per year
Original language | English |
---|---|
Title of host publication | Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on |
Pages | 37-42 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2013 |
Keywords / Materials (for Non-textual outputs)
- copper
- electroplating
- integrated circuit interconnections
- photoresists
- three-dimensional integrated circuits
- Cu
- Kelvin contact resistance structures
- Kelvin test structures
- bottom-up electroplating
- contact chain test structures
- electrical evaluation
- high aspect ratio TSV arrays
- planarised sacrificial photoresist
- size 240 mum
- size 6 cm
- through-silicon-via technology
- Daisy chain
- Kelvin structure
- TSV
- photoresist CMP
Projects
- 1 Finished