Test structures for electrical evaluation of high aspect ratio TSV arrays fabricated using planarised sacrificial photoresist

R. Zhang, Y. Li, J. Murray, A.S. Bunting, S. Smith, C.C. Dunare, J.T.M. Stevenson, M.P. Desmulliez, A.J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationMicroelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
Pages37-42
Number of pages6
DOIs
Publication statusPublished - 2013

Keywords

  • copper
  • electroplating
  • integrated circuit interconnections
  • photoresists
  • three-dimensional integrated circuits
  • Cu
  • Kelvin contact resistance structures
  • Kelvin test structures
  • bottom-up electroplating
  • contact chain test structures
  • electrical evaluation
  • high aspect ratio TSV arrays
  • planarised sacrificial photoresist
  • size 240 mum
  • size 6 cm
  • through-silicon-via technology
  • Daisy chain
  • Kelvin structure
  • TSV
  • photoresist CMP

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