Test Structures for Seed Layer Optimisation of Electroplated Ferromagnetic Films

Coinneach Mackenzie Dover, Alan W. S. Ross, Stewart Smith, Jonathan Terry, Andrew Mount, Anthony Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.
Original languageEnglish
Title of host publicationProceedings of the 2018 IEEE International Conference on Microelectronic Test Structures
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages63-68
ISBN (Print)978-1-5386-5071-4
Publication statusPublished - 19 Mar 2018

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