Test structures for the characterisation of sensor packaging technology

Ewen Blair; Anthony Buchoux; Andreas Tsiamis; Camelia Dunare; Jamie Marland; Jonathan Terry; Stewart Smith; Anthony Walton

Test structures for the characterisation of sensor packaging technology

Ewen Blair, Anthony Buchoux, Andreas Tsiamis, Camelia Dunare, Jamie Marland, Jonathan Terry, Stewart Smith, Anthony Walton

School of Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract / Description of output

This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

Original language	English
Pages	139 - 144
Number of pages	6
Publication status	Published - 28 Mar 2017
Event	International Conference on Microelectronic Test Structures - Grenoble, France Duration: 28 Mar 2017 → 30 Mar 2017

Conference

Conference	International Conference on Microelectronic Test Structures
Abbreviated title	ICMTS
Country/Territory	France
City	Grenoble
Period	28/03/17 → 30/03/17

Access to Document

ICMTS17EBlairAccepted author manuscript, 1.03 MB

Implantable Microsystems for Personalised Anti-Cancer Therapy
Murray, A., Smith, S. & Walton, A.
EPSRC
27/05/13 → 31/05/19
Project: Research

Test Structures for the Characterisation of Sensor Packaging Technology
Blair, E. (Creator), Edinburgh DataShare, 13 Jan 2017
DOI: 10.7488/ds/1695
Dataset

Cite this

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title = "Test structures for the characterisation of sensor packaging technology",

abstract = "This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor. ",

author = "Ewen Blair and Anthony Buchoux and Andreas Tsiamis and Camelia Dunare and Jamie Marland and Jonathan Terry and Stewart Smith and Anthony Walton",

year = "2017",

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TY - CONF

T1 - Test structures for the characterisation of sensor packaging technology

AU - Blair, Ewen

AU - Buchoux, Anthony

AU - Tsiamis, Andreas

AU - Dunare, Camelia

AU - Marland, Jamie

AU - Terry, Jonathan

AU - Smith, Stewart

AU - Walton, Anthony

PY - 2017/3/28

Y1 - 2017/3/28

N2 - This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

AB - This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.

M3 - Paper

SP - 139

EP - 144

T2 - International Conference on Microelectronic Test Structures

Y2 - 28 March 2017 through 30 March 2017

ER -

Test structures for the characterisation of sensor packaging technology

Abstract / Description of output

Conference

Access to Document

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Projects

Implantable Microsystems for Personalised Anti-Cancer Therapy

Datasets

Test Structures for the Characterisation of Sensor Packaging Technology

Cite this