Test structures for the characterisation of sensor packaging technology

Ewen Blair, Anthony Buchoux, Andreas Tsiamis, Camelia Dunare, Jamie Marland, Jonathan Terry, Stewart Smith, Anthony Walton

Research output: Contribution to conferencePaperpeer-review

Abstract / Description of output

This paper presents three test structures targeted at characterising sensor packaging materials for liquid environments. The test structures enable the evaluation of: 1) the successful removal of packaging material on sensing areas, 2) the permeability of the packaging material to its environment, 3) electrical continuity through the packaging process, and 4) the ingress of the liquid environment between the packaging material and the chip surface. The paper presents an example of the evaluation of a UV curable resin as packaging process for a biomedical sensor.
Original languageEnglish
Pages139 - 144
Number of pages6
Publication statusPublished - 28 Mar 2017
EventInternational Conference on Microelectronic Test Structures - Grenoble, France
Duration: 28 Mar 201730 Mar 2017


ConferenceInternational Conference on Microelectronic Test Structures
Abbreviated titleICMTS


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