Test structures for the electrical characterisation of platinum deposited by focused ion beam

S Smith, A J Walton, S Bond, A W S Ross, Tom Stevenson, A M Gundlach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract / Description of output

Focused Ion Beam (FIB) systems are commonly used to image, repair and modify integrated circuits by cutting holes in passivation to create vias or to selectively break metal tracks. The ion beam can also be used to deposit a metal, such as platinum, to create new connections. These techniques are very useful tools for debugging designs and testing possible changes to the circuit without the expense of new mask sets or silicon. This paper presents test structures to characterise a FIB platinum deposition process. Sheet resistance test structures have been fabricated using a FIB tool and the results of testing these structures are presented. This data will enable resistors with a known value to be fabricated in addition to conducting straps.

Original languageEnglish
Title of host publicationICMTS 2002:PROCEEDINGS OF THE 2002 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES
Place of PublicationNEW YORK
PublisherInstitute of Electrical and Electronics Engineers
Pages157-162
Number of pages6
ISBN (Print)0-7803-7464-9
Publication statusPublished - 2002
Event15th International Conference on Microelectronic Test Structures - CORK
Duration: 8 Apr 200211 Apr 2002

Conference

Conference15th International Conference on Microelectronic Test Structures
CityCORK
Period8/04/0211/04/02

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